Lintek HDI multilayer printed circuit boards

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Lintek is offering its clients copper-filled ‘via in pad’ technology for BGA devices down to 0.35 mm pitch. The company provides blind, buried and castellated vias on multilayer circuit boards manufactured on a wide variety of dielectrics.

Lintek creates total solutions for the most demanding environments. Its boards are used in a wide range of industries, from cutting-edge military EW systems to amateur electronics projects. The company says it values all clients, no matter what the requirement.

Lintek has IPC-A-600 certified staff and trainer on-site. All PCBs are manufactured to IPC Class 2 minimum. Certification is available on request.

The company is compliant with Quality System AS/NZS ISO 9001:2008. Subject to material and process constraints, it is able to produce boards with Underwriters Laboratories (UL) approval.