Advantech MIO-5272 fanless SBC

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Advantech announces the MIO-5272 SBC in a 3.5″ MI/O Extension (146 x 102 mm) form factor, based on Intel 6th generation Core i7/i5/i3/Celeron processors with triple independent display capability. With an optimised thermal solution, fanless design has been made possible on this compact, high-performance platform under wide temperature environments (-40 to 85°C).

The product comes with Advantech’s iManager and WISE-PaaS/RMM integrated to monitor and control system operation remotely and effectively. These tools provide a smart software framework for the embedded customer, helping to speed up time-to-value for IoT and intelligent system design.

The computer adapts the latest microarchitecture with 64-bit, multicore processors built on 14 nm process technology. It delivers improvements in CPU processing, graphics, security capabilities and I/O flexibility. In terms of overall performance, it is said to offer a >30% improvement in processor arithmetic (GOPS) and more than double in graphics performance, compared to the previous version.

The product supports dual memory channels, which expands total memory size from 8 to 16 GB and  increases memory bandwidth. With 2 mini PCIe expansion slots, the unit can not only serve applications that require 3G/4G Lite modules and ruggedised mSATA storage, but it can also serve the requirements for Wi-Fi and Bluetooth modules.

The device enhances security protection and meets the TPM (Trusted Platform Module) 2.0 standard for security protection. It not only facilitates seamless integration and permits high-efficiency network use, but also incorporates the MIOe unified connector which can extend additional interfaces, integrating DisplayPort, PCIe x1, LPC, SMBus, USB 2.0/USB 3.0, audio line-out and power.

The benefits of fanless design include longer MTBF, dust-free, noiseless, zero fan maintenance and 24/7 operation. The MIO-5272 thermal solution is suitable for medical, automation, military or transportation applications, while the unit’s compact 24 mm height makes it suitable for IoT and embedded systems.

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