Design

Design environment enhanced for power supply applications

29 March, 2017 by | Supplied by: STMicroelectronics Pty Ltd

STMicroelectronics is extending the focus of its eDesignSuite online design environment with the addition of complementing components from Würth Elektronik, a major transformer manufacturer, to help customers complete their new projects quickly and cost-effectively.


XJTAG software for PADS schematic design

29 March, 2017 by | Supplied by: Alfa-Tek Australia

The XJTAG software for PADS schematic design significantly increases the design for test and debug capabilities of the schematic capture and PCB design environment.


Free access to audio design tool

22 March, 2017 by | Supplied by: STMicroelectronics Pty Ltd

Small electronic products like wearables and IoT devices can now provide high-end audio features with the help of a graphical design tool for STM32 microcontrollers from STMicroelectronics.


3D-printed aerospace components on show

03 March, 2017 by | Supplied by: Monash University

Monash University has used a $3.5 million 3D printer to produce an aluminium door hinge for a Chinese jet airliner.


Liquid metals create nanometre-thick ICs

21 February, 2017 by | Supplied by: RMIT University

Scientists are using liquid metals to create integrated circuits (ICs) that are merely atoms thick, opening the way for the production of large wafers around 1.5 nm in depth.


Maxim MAXREFDES143# embedded security reference design

16 February, 2017 by | Supplied by: Avnet Electronics Marketing

The Maxim MAXREFDES143# embedded security reference design provides protection against counterfeit sensor data, guaranteeing its authenticity and integrity along the entire data chain, from transducer to the cloud.


Infineon Technologies TLE984x LIN-based relay driver ICs

15 February, 2017 by | Supplied by: Infineon Technologies Australia Pty Ltd

The Infineon Technologies TLE984x LIN-based relay driver ICs bring together the ARM Cortex-M0 core and the peripherals of its predecessor TLE983x (XC800 based relay driver).


Venus-resistant electronics developed by NASA

14 February, 2017 by Lauren Davis

NASA scientists recently demonstrated the first prolonged operation of electronics in the harsh conditions found on Venus, in news which could enable new scientific missions to Earth's closest neighbour.


STMicroelectronics BlueNRG-1 system-on-chip

12 January, 2017 by | Supplied by: Mouser Electronics

The STMicroelectronics BlueNRG-1 system-on-chip contains a Bluetooth low energy radio.


Mean Well LRS series power supplies

11 January, 2017 by | Supplied by: Soanar Limited

Mean Well's LRS series power supplies are single-output, enclosed-type power supplies ranging in power from 35 to 150 W. Compared to the RS series, they are said to deliver better performance in a smaller package.


Gadget Renesas SAKURA-II and SAKURA-FULL prototyping boards

19 December, 2016 by | Supplied by: RS Components Pty Ltd

The Gadget Renesas SAKURA-II and SAKURA-FULL are general-purpose programmable boards that offer a highly flexible platform suitable for a range of levels of software development experience.


Toshiba TC7739FTG multi-output system power IC

16 December, 2016 by | Supplied by: Toshiba (Australia) Pty Ltd

The Toshiba TC7739FTG is a general-purpose, multi-output system power IC equipped with DC-DC power supplies and serialised regulators.


RECOM REDIN120 and REDIN240 DIN rail power supplies

05 December, 2016 by | Supplied by: RECOM Power GmbH

RECOM has added DIN rail power supply rated at 120 and 240 W to its existing range. The series supports brief peaks of 50% above rating and the modules can be connected in parallel to increase the output power available or for redundancy.


Making the right product choices for harsh environments

05 December, 2016 by David Pike, Product Marketing | Supplied by: RS Components Pty Ltd

Electronic devices and systems located in harsh environments will always struggle to perform as required if they are not built with the appropriate components.


One in five electronics engineers experience thermal issues

23 November, 2016 by Lauren Davis

Future Facilities has conducted a survey of over 350 professional electronics engineers in an effort to learn how they cope with thermal issues.


More Design categories

// Componentry // ICs // Power supplies // Semiconductors // Software

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