STMicroelectronics has joined the Car Connectivity Consortium — a cross-industry organisation advancing global technologies for smartphone-to-car connectivity solutions.
STMicroelectronics has recorded cumulative sales of over 1 billion units for its ST33 embedded-security ICs, reflecting the growing imperative to protect data and systems in secure mobile-consumer, smart-driving, smart-industry and smart-cities applications.
STMicroelectronics will acquire 55% of Norstel's share capital, with an option to acquire the remaining 45% subject to certain conditions.
The project seeks to address emerging requests for protection against intrusion via communication buses in automotive body and gateway applications.
Electronics company Cree has signed a multiyear agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to STMicroelectronics.
STMicroelectronics has partnered with Fidesmo in the creation of a turnkey active solution for secure contactless payments on smart watches and other wearable technology.
The Top 10 Power Product Award, from 21ic.com and Electronic Products China, recognises what is believed to be the smallest 45 V motor driver in the world that can achieve a resolution of up to 256 microsteps.
STMicroelectronics' FingerTip touchscreen controller (TSC) is powering all three of the latest Xiaomi Mi8 smartphone models — Standard, SE and Explorer.
STMicroelectronics and Leti have announced their cooperation to industrialise gallium nitride-on-silicon technologies for power switching devices.
STMicroelectronics and TomTom have announced a package of development tools in the STM32 Open Development Environment that connect directly to TomTom Maps APIs for location, tracking and mapping data services.
Semiconductor company STMicroelectronics has reported its US GAAP financial results for the second quarter ended 30 June.
Semiconductor company STMicroelectronics has announced its acquisition of software specialist Draupner Graphics.
STMicroelectronics has become the first embedded SIM (eSIM) manufacturer to be accredited by the GSMA for loading eSIM chips with connection credentials such as certificates and operator profiles before shipping.
Near-field communication technology from STMicroelectronics has been selected to power the contactless features of TCL Communication's Alcatel 3V smartphone.
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