ASQED announces 2011 program

The third Asia Symposium on Quality Electronic Design has announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations.

ASQED is being held 19-20 July 2011 in Kuala Lumpur, Malaysia. ASQED plays a role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor, nanoelectronic, bioelectronic, MEMS and NEMS systems, photovoltaic technologies and disciplines such as design, manufacturing, test and packaging.

ASQED keynote sessions are sponsored by Synopsys and include: nanotechnology and the challenges facing designers of circuits and systems; electronics for energy management; the packaging technology domain; challenges in interconnection; advances in high-density interconnections - promoting innovations and lower costs.

ASQED is offering the following tutorials by industry experts: a tool box for successful 3D integration; modern 3D packaging technologies driving the need for IC, package and printed circuit board (PCB) co-design methodologies; memory packaging challenges and approaches for the evolving world of the portable client and cloud; 3D silicon interposer and through silicon via (TSV): application, requirement, infrastructure and technologies.