Assembly

RS Components Raspberry Pi prototyping board

16 February, 2017 by | Supplied by: RS Components Pty Ltd

The RS Components Raspberry Pi prototyping board is suitable for electronics engineers, as well as being well suitable for education and the training of students and electronics beginners.


Low-temperature soldering reduces emissions

15 February, 2017 by | Supplied by: lenovo

Technology company Lenovo has announced a new low-temperature solder (LTS) process, developed to improve PC manufacturing by conserving energy and increasing reliability.


Advantech AIMB-216 Thin Mini-ITX Motherboard

01 February, 2017 by | Supplied by: Advantech Australia Pty Ltd

Advantech has announced the AIMB-216, an industrial-grade fanless Thin Mini-ITX motherboard. With Intel Pentium/Celeron N3710/N3160/N3010 processor support, plus the latest Intel 14 nm technology, it offers significant CPU and graphics performance improvements with low power consumption.


EXAIR Ion Air Cannon

19 January, 2017 by | Supplied by: Compressed Air Australia Pty Ltd

EXAIR's Ion Air Cannon eliminates static electricity and cleans at distances up to 4.6 m, with no moving parts. It is suitable for benchtops, machine mounting and those hard-to-reach spaces that require a concentrated flow of static-eliminating ions.


3D-printed drone features embedded electronics

06 December, 2016 by

Singaporean researchers have 3D-printed a ready-to-fly drone with embedded electronics using aerospace-grade material.


Axiomtek IMB500 industrial ATX motherboard

24 November, 2016 by | Supplied by: Braemac Pty Ltd

The Axiomtek IMB500 industrial ATX motherboard is powered by 6th generation Intel Core, Pentium and Celeron processors in the LGA1151 socket with Intel Q170 chipset.


Screen Process Circuits die cut and laser cut gaskets

07 November, 2016 by | Supplied by: Screen Process Circuits

Screen Process Circuits die cut and laser cut gaskets can be manufactured in many shapes, sizes and thicknesses and from a variety of different materials to meet sealing requirements.


OKW enclosure customisation service

04 November, 2016 by | Supplied by: ROLEC OKW Australia New Zealand P/L

OKW Gehäusesysteme has a versatile range of design-oriented plastic enclosures and tuning knobs. However, the requirement for customisation can also be fulfilled by the company's in-house service centre.


TE Connectivity SmartSeal connector

21 October, 2016 by | Supplied by: Commscope

TE Connectivity's rugged SmartSeal connector is designed to withstand the demands of the two-wheeler, ATV/UTV, leisure marine and recreational vehicle markets.


Four strategies to strengthen subassembly sourcing

20 October, 2016 by Ed Sullivan*

Selecting subassembly manufacturers with specific capabilities can speed turnaround, improve product performance and functionality, and increase an OEM's bottom line.


HMicro HC1100 wearable wireless biosensor chip

12 October, 2016 by | Supplied by: STMicroelectronics Pty Ltd

HMicro and STMicroelectronics have launched a cooperation to create a single-chip solution for clinical-grade, single-use disposable smart patches and biosensors.


Hammond Electronics 1590 die-cast enclosures

01 September, 2016 by | Supplied by: Hammond Electronics Pty Ltd

The 1590 die-cast enclosures family from Hammond Electronics consists of 41 different sizes in the standard rectangular and STOMP Box painted variants.


Making a splash in water-resistant digital devices

26 August, 2016 by

The trend in consumer electronics has always been to make them faster, smarter and with ever-expanding capabilities. But waterproofing has become the new focus of global electronics manufacturers and most brands are rushing to include this benefit to ensure they are not left behind in this ultracompetitive market.


ROLEC enclosures IP67/IP69K protection class upgrades

25 August, 2016 by | Supplied by: ROLEC OKW Australia New Zealand P/L

ROLEC now offers its diecast aluminium enclosures with the option of factory-fitted IP protection class upgrades. Depending on the type of enclosure, the ratings can be increased from IP66 to IP67 and from IP67 to IP69K.


Lintek HDI multilayer printed circuit boards

28 July, 2016 by | Supplied by: Lintek Pty Ltd

Lintek is offering its clients copper-filled 'via in pad' technology for BGA devices down to 0.35 mm pitch. The company provides blind, buried and castellated vias on multilayer circuit boards manufactured on a wide variety of dielectrics.


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