Advantech has announced the AIMB-216, an industrial-grade fanless Thin Mini-ITX motherboard. With Intel Pentium/Celeron N3710/N3160/N3010 processor support, plus the latest Intel 14 nm technology, it offers significant CPU and graphics performance improvements with low power consumption.
EXAIR's Ion Air Cannon eliminates static electricity and cleans at distances up to 4.6 m, with no moving parts. It is suitable for benchtops, machine mounting and those hard-to-reach spaces that require a concentrated flow of static-eliminating ions.
Singaporean researchers have 3D-printed a ready-to-fly drone with embedded electronics using aerospace-grade material.
Screen Process Circuits die cut and laser cut gaskets can be manufactured in many shapes, sizes and thicknesses and from a variety of different materials to meet sealing requirements.
OKW Gehäusesysteme has a versatile range of design-oriented plastic enclosures and tuning knobs. However, the requirement for customisation can also be fulfilled by the company's in-house service centre.
Selecting subassembly manufacturers with specific capabilities can speed turnaround, improve product performance and functionality, and increase an OEM's bottom line.
The trend in consumer electronics has always been to make them faster, smarter and with ever-expanding capabilities. But waterproofing has become the new focus of global electronics manufacturers and most brands are rushing to include this benefit to ensure they are not left behind in this ultracompetitive market.
ROLEC now offers its diecast aluminium enclosures with the option of factory-fitted IP protection class upgrades. Depending on the type of enclosure, the ratings can be increased from IP66 to IP67 and from IP67 to IP69K.
Lintek is offering its clients copper-filled 'via in pad' technology for BGA devices down to 0.35 mm pitch. The company provides blind, buried and castellated vias on multilayer circuit boards manufactured on a wide variety of dielectrics.