Deliver next-level capability, speed and performance
Supplied by Nano Dimension on Thursday, 19 May, 2022
New opportunities using additively manufactured electronics (AME) mean that use of the 3D space can deliver the ability to more efficiently integrate electrical, optical, thermal, magnetic and mechanical properties within a single package.
Learn how AME enables 3D heterogeneous integration to continue to keep Moore’s Law valid while delivering new possibilities and innovation in electronics design and production.
The future of standardised defence platforms using MOSA, SOSA and VPX open architectures
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New highly efficient bidirectional DC-DC converter for DC-BUS and battery bank interface
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Industrial Bus and Network Standards
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