Components

Texas A&M researchers discover new circuit element

14 April, 2023 by Rachel Rose, Texas A&M Engineering

Researchers have shown the first physical evidence of meminductance in a two-terminal passive system comprising an electromagnet interacting with a pair of permanent magnets.


Aussie ultracapacitor tech achieves up to double energy density

12 April, 2023

Melbourne-based company enyGy has developed graphene technology that allows ultracapacitors to achieve up to double the amount of energy density in the same size package.


New chip design enhances precision in memory

05 April, 2023

USC researchers have announced a "breakthrough" in memristive technology that could shrink edge computing for AI to smartphone-sized devices.


Silicon photonic MEMS developed for semiconductor manufacturing

29 March, 2023

Researchers have created silicon photonic micro-electromechanical systems (MEMS) that can be fabricated using semiconductor manufacturing processes.


New spintronics process paves the way for faster computer chips

22 March, 2023

Researchers have developed a process for making spintronic devices that could create semiconductor chips with enhanced energy efficiency and storage for use in computers.


Researchers demonstrate ultra-fast beam steering

22 March, 2023

A team of researchers has demonstrated the ability to dynamically direct light pulses from conventional, incoherent light sources, marking an advance in the field of nanophotonics.


Superconducting amplifiers provide high performance, low power consumption

22 March, 2023

Researchers have developed a new concept of superconducting microwave low-noise amplifiers and demonstrated a high-performance cooled amplifier with low power consumption.


Using phosphorus semiconductors to boost transistor performance

16 March, 2023

Researchers have found that ultrathin phosphorus semiconductors that become metallic when stacked can boost transistor performance.


New semiconductor material could cut heat emissions

16 March, 2023

Researchers have created an oxide ceramic material that has the potential to reduce the amount of heat released into the atmosphere by power plants.


STMicroelectronics STM32C0 32-bit MCU

14 March, 2023 | Supplied by: STMicroelectronics Pty Ltd

The STMicroelectronics STM32C0 32-bit MCU offers up to 32 KB of flash memory and 6 to 12 KB of RAM.


Reducing the environmental impact of flexible electronics

08 March, 2023

A study led by the VTT Technical Research Centre of Finland has found that the environmental impact of flexible electronics can be reduced by almost 90%.


Quectel cellular RM5XXQ series 5G modules

07 March, 2023 | Supplied by: Quectel

The Quectel cellular RM5XXQ series of 5G modules is designed to connect IoT devices to cellular networks, with ultra-high data rates and ultra-low latency.


Silvertel Ag7010 high power PoL DC/DC buck converter module

06 March, 2023 | Supplied by: Fairmont Marketing

Silvertel's Ag7010 High Efficiency Point of Load (PoL) Buck Converter Module features a wide input voltage range from 8–24 V and an output range from 3–12.7 V.


New tech could create next-level 'metasurface' flat screens

03 March, 2023

Researchers have created nanoparticles called 'metasurfaces' that reportedly perform better than existing liquid crystal displays (LCDs) and light emitting diode displays (LEDs).


Microchip Technology SAMA7G54 single-core MPU

02 March, 2023 | Supplied by: Microchip Technology Hong Kong Limited

The SAMA7G54 single-core low-power MPU from Microchip is designed to provide flexible low-power modes as well as voltage and frequency scaling.


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