Qualcomm and TDK form RFFE joint venture
By ElectronicsOnline Staff
Friday, 10 February, 2017
Technology companies Qualcomm and TDK have completed a joint venture under the name RF360 Holdings — a Singaporean corporation, headquartered in Munich, with R&D and manufacturing and/or sales locations in Europe and Asia.
With more than 4000 employees worldwide, RF360 Holdings will develop and manufacture innovative RF front-end (RFFE) filtering solutions for mobile devices and fast-growing business segments, such as IoT, drones, robotics, automotive applications and more. It will offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe.
In addition to operating the joint venture, Qualcomm and TDK will deepen their technological cooperation to cover a wide range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications.
“The deeper collaboration with Qualcomm fits perfectly into our growth strategy,” said TDK President and CEO Shigenao Ishiguro. “It is a further step that aims to open up new promising business opportunities for TDK while strengthening the company’s innovativeness and thus competitiveness in such attractive future markets as sensors, MEMS, wireless charging and batteries. Our customers will clearly benefit from the resulting unique and comprehensive technologies and products portfolio.”
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