Components > Modules

Linear Technology battery chargers

15 September, 2009

Linear Technology has introduced the LT3650-4.1 and LT3650-4.2 compact, monolithic, high-voltage battery chargers for single-cell Li-Ion polymer batteries.


Data module

17 August, 2009 by

Telit has released the UC864-WD, a 3G wireless data module designed to be fully compatible with the company’s GSM/GPRS and CDMA products in the compact, unified form factor family.


Receiver module

17 August, 2009 by

Fastrax has introduced its UC324 OEM GPS receiver module that uses the SiRF single chip receiver GSC3LT having navigation sensitivity of -159 dBm.


Thermocouple module

28 July, 2009

National Instruments has announced the NI 9213 thermocouple module that adds high-density measurements to the C series platform.


Power modules

28 July, 2009

Vishay has unveiled its Gen VII series of general-purpose, high-voltage power modules that feature increased current handling, lighter weight, lower thermal resistance, improved reliability and lead-free construction.


Line digital I/O modules

28 July, 2009

Interworld Electronics has released two USB-104 form factor digital I/O modules from Acces I/O.


Networking module

17 June, 2009 by

Lantronix has enhanced its MatchPort b/g Pro embedded wireless networking module by including ethernet-to-wireless bridging and SmartRoam technology.


Front-end modules

17 June, 2009 by

Microsemi has released the LX5551 and LX5552 front-end modules for IEEE 802.11b/g/n applications in the 2.4–2.5 GHz frequency range.


Wireless module

17 June, 2009 by

LPRS has introduced the MU-2-R, an embedded low-power radio modem, for transmitting serial data at 434 MHz.


Ethernet modules

17 June, 2009 by

Interworld has released Quatech’s Airborne enterprise class wireless ethernet modules.


Broadband modules

17 June, 2009 by

RF Micro Devices has added two broadband units to its range of transmission products.


SKiiP4 power module

17 June, 2009

SKiiP4, the latest generation of intelligent IGBT power modules, has a longer service life than non-sintered modules and can be used in higher temperatures.


Wireless CPU

10 June, 2009

The Wavecom Q26 Extreme 3G/HSPA module offers tri-band HSPA with quad-band GSM/GPRS/EDGE as well as a programmable Wireless CPU.


Modular supply

01 June, 2009 by

Powerbox has introduced three high-power DC modules for the ReFlex Power programmable, modular power system.


LAN dual-band modules

01 June, 2009 by

M2M Connectivity has released wireless LAN dual-band modules.


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