If you work with high-speed serial links such as PCIe, USB, SATA, Infiniband or gigabit ethernet, you have encountered S-parameters. This method of describing the electrical properties of interconnects, standard in the microwave world for more than 60 years, is becoming the de facto standard in the high-speed digital world as well.

The Belgian research centre imec, together with Plextronics and Solvay, has produced an organic polymer-based single junction solar cell with 6.9% performance in an inverted device stack.

Common mode chokes filter common mode EMI currents without causing signal degradation and without derating under high currents. These components are applied to pairs of conductors - supply and return.

The environments in which microwave cable assemblies are being used today are becoming more challenging with exposure to such conditions as extreme temperatures, chemicals, abrasion and flexing. Additional challenges include the need for smaller, lighter packaging for cable systems that last longer and cost less.

Electronics, to make businesses more efficient through organising sales and record keeping and to reduce the quality of paper used, has been the holy grail of organisations since computers were welcomed into the fold as a business tool. In this article, the author looks at some of the achievements, challenges and pitfalls that a dedicated eprocurement system can bring.

System power engineers have many choices in today’s power connector market and the list of options is growing as the industry diversifies to offer more specialised products. Here are some commonly asked questions:

According to Australian leading electronics solutions provider Benbro Electronics, electronic designers need to consider a number of factors to achieve power quality when designing a lighting system. This is more so with the advent of LEDS, compact fluorescent lighting (CFL), high intensity discharge (HID) lighting and other new technologies in lighting.

The environments in which microwave cable assemblies are being used today are becoming more challenging with exposure to such conditions as extreme temperatures, chemicals, abrasion, and flexing. Additional challenges include the need for smaller, lighter packaging for cable systems that last longer and cost less.

Embedded software intended for aerospace and military applications must operate with the utmost concern for safety. To achieve reliability goals, software development teams strive for these applications to meet rigorous verification processes and the goal of zero defects.

Such highly coveted technical capabilities as the observation of single catalytic processes in nanoreactors or the optical detection of low concentrations of biochemical agents and gases are an important step closer to fruition.

With its promise of superfast computers and ultrapowerful optical microscopes among the many possibilities, plasmonics has become one of the hottest fields in high technology.

The consumer market for telephone headsets is noted for its innovative products and its fast pace. Companies produce products with new features almost weekly. In this environment, the market life of headsets is becoming very short; in fact, some products can have a life of only six months or so.

Of all of the specifications of a battery-powered device, the battery run time is key. Every user wants their device to run longer on a charge. Therefore, to know the run time of your device is important, not only to represent the device to the end user, but as a means of knowing if improvements in power management within the device are successful at increasing battery run time.

As microprocessors get increasingly more powerful, so does the appetite for additional software functionalities. Size of embedded systems software increases every year, bringing new types of problems. This is the final part of a three-part series.

As microprocessors get increasingly more powerful, so does the appetite for additional software functionalities. Size of embedded systems software increases every year, bringing new types of problems.

This is the second part of a three-part series.