Teledyne SCION VIS-SWIR cameras
21 January, 2026 | Supplied by: Teledyne e2v Asia Pacific LimitedTeledyne has launched the SCION Family of short-wave infrared (SWIR) cameras for a range of applications including material analysis and defect detection.
STMicroelectronics STM32MP21 microprocessors
15 January, 2026 | Supplied by: STMicroelectronics Pty LtdThe STM32MP21 microprocessors from STMicroelectronics feature a powerful processing engine and robust security architecture.
New materials could boost the energy efficiency of microelectronics
13 January, 2026 by Adam Zewe, MIT NewsBy stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
Nano framework unlocks printable 2D electronics
11 December, 2025 by Trinity College DublinResearchers have developed a predictive framework for 2D-material exfoliation — enabling low-cost, printable electronics including transistors, circuits and flexible sensors.
Diamond sensor reveals hidden magnetic fluctuations
05 December, 2025 by Scott Lyon, Princeton UniversityScientists have used entangled defects in diamonds to detect magnetic signals at record sensitivity, opening new doors in physics and technology.
Single-photon switch advances photonic computing
27 November, 2025 by Purdue University College of EngineeringResearchers have demonstrated a single-photon photonic transistor, enabling light-based switching at ultra-low power levels.
Toshiba DCL52xx00 Series standard digital isolators
12 November, 2025 | Supplied by: Toshiba (Australia) Pty LtdToshiba has released a series of standard digital isolators that are suitable for a range of multi-channel high-speed communication applications.
Alta Data Technologies MP2-1553 interface card
11 November, 2025 | Supplied by: Metromatics Pty LtdThe MP2-1553 interface card from Alta Data Technologies is designed for next-generation embedded avionics systems.
Light-based chip boosts AI power efficiency
18 September, 2025 by Eric Hamilton, University of FloridaResearchers have developed an optoelectronic silicon chip to perform convolution operations for artificial intelligence.
Semikron Danfoss thermal interface material
04 September, 2025 | Supplied by: Semikron DanfossSemikron Danfoss offers a range of power modules with pre-applied thermal interface material.
Advantech MIC-743 edge AI platform
01 September, 2025 | Supplied by: Advantech Australia Pty LtdThe Advantech MIC-743 edge AI platform enables businesses to accelerate innovation and unlock new opportunities in intelligent edge applications.
Shining a UV light on next-gen computer chips
01 August, 2025 by Eric Stann, University of MissouriA recent study could help scientists and engineers build faster, cheaper and more eco-friendly electronics.
Tiny sensor could turn a smartphone into a spectrometer
31 July, 2025 by Matt Shipman, North Carolina State UniversityResearchers have created a tiny spectrometric device the size of just a few millimetres, which can potentially be installed in a smartphone.
Predicting spin accumulation for faster, greener memory
31 July, 2025Researchers have developed a computational tool to predict the spin accumulation coefficient in spintronic materials.
Safer, eco-friendly plastic developed for wearable tech
09 July, 2025Researchers have created a new type of flexible electronic polymer that could replace environmentally harmful materials in wearable devices, sensors and more.
