FAULHABER diameter-matched components
01 May, 2025 | Supplied by: ERNTEC Pty LtdFAULHABER has released a range of components, including precision motors, gearheads and encoders, that are designed for seamless integration and enhanced performance.
Transforming marker ink into an electrical circuit
01 May, 2025A red marker ink containing eosin dye can be converted into a graphene-based electric circuit on any surface using a laser, thereby enabling flexible sensor fabrication.
Ultra-thin cooling solution for mobile devices
15 April, 2025Scientists have developed an innovative cooling device — an ultra-thin loop heat pipe — that improves heat control for electronic components in smartphones and tablets.
Scientists unveil flexible OLED panel with built-in speaker
10 April, 2025Researchers have developed a smartphone-sized OLED display that can change its shape and act as a speaker with a piezoelectric actuator.
Feeling the future: wearable tech simulates realistic touch
04 April, 2025 by Amanda Morris, Northwestern UniversityResearchers from Northwestern University have developed a device that applies dynamic forces in any direction to simulate a more realistic sense of touch.
Enhancing stability in bioelectronic materials for computing
03 April, 2025Scientists from Rice University have streamlined the production of a material widely used in computing applications and medical research.
A multimodal light manipulator
28 March, 2025 by Anne J. Manning, Harvard John A. Paulson School of Engineering and Applied SciencesA new interferometer could replace beam-splitting waveguides for fibre-optics.
Tiny component for record-breaking bandwidth
20 March, 2025 by Fabio Bergamin, ETH ZurichA modulator developed by researchers from ETH Zurich has broken the terahertz mark. The ultrafast component efficiently transmits large volumes of data into the fibre-optic network in a short space of time.
Yamaha YsUP software for SMT machinery
19 March, 2025 | Supplied by: Hawker RichardsonThe YsUP software for SMT machinery enables PCH manufacturers to overcome the challenges of disconnected machinery and multi-vendor environments.
Siemens Process Preparation Stencil Engineering Tool
19 March, 2025 | Supplied by: On-Track TechnologyThe Siemens Process Preparation Stencil Engineering Tool is designed to provide first-time-right stencils and accurate paste quantity estimates per PCBA.
Nordic Semiconductor nPM2100 Power Management IC
19 March, 2025 | Supplied by: Nordic SemiconductorThe nPM2100 PMIC features an efficient boost regulator and a range of energy-saving features to extend operating time in non-rechargeable battery applications.
How AI is remodelling the IoT
17 March, 2025 by Kjetil Holstad, EVP Strategy & Product Management, Nordic Semiconductor | Supplied by: Nordic SemiconductorIncorporating AI into the IoT will dramatically enhance its capability and flexibility. But first, significant engineering challenges will need to be overcome.
Breaking the surface: how damage reshapes ripples in graphene
07 March, 2025Scientists have discovered how defects in the surface of two-dimensional sheets alter ripple effects, even freezing the sheets altogether.
Yamaha Robotics 1-Stop Smart Solution surface-mounter hardware
04 March, 2025 | Supplied by: Hawker RichardsonThe 1-Stop Smart Solution from Yamaha Robotics enhances the performance of its high-speed pick and place machines.
Compact comb lights the way for next-gen photonics
05 February, 2025 by Nik Papageorgiou, EPFLA new ultra-broadband electro-optic comb that can fit 450 nm of light precision into a chip could pave the way for more efficient photonic devices.
