Design

FAULHABER diameter-matched components

01 May, 2025 | Supplied by: ERNTEC Pty Ltd

FAULHABER has released a range of components, including precision motors, gearheads and encoders, that are designed for seamless integration and enhanced performance.


Ultra-thin cooling solution for mobile devices

15 April, 2025

Scientists have developed an innovative cooling device — an ultra-thin loop heat pipe — that improves heat control for electronic components in smartphones and tablets.


Scientists unveil flexible OLED panel with built-in speaker

10 April, 2025

Researchers have developed a smartphone-sized OLED display that can change its shape and act as a speaker with a piezoelectric actuator.


Feeling the future: wearable tech simulates realistic touch

04 April, 2025 by Amanda Morris, Northwestern University

Researchers from Northwestern University have developed a device that applies dynamic forces in any direction to simulate a more realistic sense of touch.


Enhancing stability in bioelectronic materials for computing

03 April, 2025

Scientists from Rice University have streamlined the production of a material widely used in computing applications and medical research.


A multimodal light manipulator

28 March, 2025 by Anne J. Manning, Harvard John A. Paulson School of Engineering and Applied Sciences

A new interferometer could replace beam-splitting waveguides for fibre-optics.


Tiny component for record-breaking bandwidth

20 March, 2025 by Fabio Bergamin, ETH Zurich

A modulator developed by researchers from ETH Zurich has broken the terahertz mark. The ultrafast component efficiently transmits large volumes of data into the fibre-optic network in a short space of time.


Yamaha YsUP software for SMT machinery

19 March, 2025 | Supplied by: Hawker Richardson

The YsUP software for SMT machinery enables PCH manufacturers to overcome the challenges of disconnected machinery and multi-vendor environments.


Siemens Process Preparation Stencil Engineering Tool

19 March, 2025 | Supplied by: On-Track Technology

The Siemens Process Preparation Stencil Engineering Tool is designed to provide first-time-right stencils and accurate paste quantity estimates per PCBA.


Nordic Semiconductor nPM2100 Power Management IC

19 March, 2025 | Supplied by: Nordic Semiconductor

The nPM2100 PMIC features an efficient boost regulator and a range of energy-saving features to extend operating time in non-rechargeable battery applications.


How AI is remodelling the IoT

17 March, 2025 by Kjetil Holstad, EVP Strategy & Product Management, Nordic Semiconductor | Supplied by: Nordic Semiconductor

Incorporating AI into the IoT will dramatically enhance its capability and flexibility. But first, significant engineering challenges will need to be overcome.


Breaking the surface: how damage reshapes ripples in graphene

07 March, 2025

Scientists have discovered how defects in the surface of two-dimensional sheets alter ripple effects, even freezing the sheets altogether.


Yamaha Robotics 1-Stop Smart Solution surface-mounter hardware

04 March, 2025 | Supplied by: Hawker Richardson

The 1-Stop Smart Solution from Yamaha Robotics enhances the performance of its high-speed pick and place machines.


Compact comb lights the way for next-gen photonics

05 February, 2025 by Nik Papageorgiou, EPFL

A new ultra-broadband electro-optic comb that can fit 450 nm of light precision into a chip could pave the way for more efficient photonic devices.


ADLINK Technology DLAP Supreme AI platform series

23 January, 2025 | Supplied by: ADLINK Technology Inc

The DLAP Supreme AI platform series overcomes memory limitations in edge generative AI applications, thereby enhancing AI computing capabilities on edge devices.


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