Light triggers novel ferroelectric switching mechanism
05 August, 2026 by Flinders UniversityA light-triggered ferroelectric switching mechanism could improve the energy efficiency of future memory devices, sensors and emerging computing architectures.
High-entropy design enables next-gen semiconductors
05 August, 2026 by Monica Cooney, Carnegie Mellon University College of EngineeringResearchers have developed a technique using high-entropy mixing to transform insulating metal oxides into high-performance semiconductors for next-gen devices.
Crystalline rubrene film enhances OLED design
04 August, 2026Crystalline rubrene thin films formed by vacuum deposition and annealing have been integrated into OLEDs, achieving higher current density than conventional amorphous devices.
Light-controlled semiconductor device directs electrons
30 July, 2026 by Matt Davenport, University of Michigan NewsResearchers have developed a light-controlled semiconductor device that directs electron flow without applied voltage, offering new possibilities for optoelectronic systems.
New computational method predicts semiconductor properties
08 July, 2026 by Nik Papageorgiou, EPFLA study led by EPFL researchers has introduced a new computational method that predicts the electronic properties of semiconductors more accurately, including materials that existing methods can sometimes misclassify as metals.
Ultra-thin transistors pave way for more efficient chips
08 July, 2026A new transistor design shows that ultra-thin devices can retain performance at nanoscale dimensions, supporting more energy-efficient chip development.
Advantech SOM-6820 COM Express compact module
01 July, 2026 | Supplied by: Advantech Australia Pty LtdThe Advantech SOM-6820 is a COM Express Compact Type 6 module with Snapdragon X processors, integrated AI acceleration and industrial-grade support.
Precision-grown nanotubes for next-gen electronics
25 June, 2026Researchers have used a new synthesis method to produce stable, atomically precise semiconductor nanotubes that could enable next-generation nanoscale electronics.
Advantech AIR-410 and AIR-420 Edge AI high-performance computers
01 June, 2026 | Supplied by: Advantech Australia Pty LtdThe AIR-410 and AIR-420 Edge AI high-performance computers are designed for data-intensive workloads such as LLMs, medical imaging and automated inspection.
Machine learning advances semiconductor materials research
28 May, 2026 by Flinders UniversityA new study from Flinders University has demonstrated a faster way to discover semiconductor materials for next-generation computing devices.
Single unit displays flexibility of modular system
21 May, 2026Researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly into a single unit.
Septentrio mosaic-G5 P6 GNSS module
19 May, 2026 | Supplied by: Digi-Key ElectronicsThe mosaic-G5 P6 is designed for commercial UAVs, robots and other size- and power-constrained applications.
3D-printed copper plate could transform data centre cooling
14 May, 2026If used to cool an entire data centre, the technology would contribute only about 1.1% of the centre's total energy usage compared to more than 30% for conventional air-cooling methods.
Chiral semiconductors that can absorb visible light
11 May, 2026 by University at BuffaloA new system can both absorb visible light and distinguish between left- and right-handed light waves, creating possibilities for optoelectronic technologies.
Pushing the limits of miniaturisation
07 May, 2026In a process once thought impossible, a tiny memory chip improves as it gets smaller, potentially leading to ultra-efficient smartphones and AI systems.
