The TI BUF802 is a high-input-impedance, open-loop, unity gain buffer amplifier that offers wide bandwidth capable of supporting frequency bandwidths up to 3.1 GHz.
Researchers have developed a way to synthesise new materials that could lead to more sustainable and environmentally friendly items like solar panels and LEDs.
Learn more about how FPGAs will empower the next-generation technology revolution with power-efficient performance in many new applications for every industry.
The National Institute of Standards and Technology and Google have partnered to make industry-standard chips available to universities, to boost semiconductor manufacturing.
Researchers have created a metasurface material that could help improve efforts to harness quantum entanglement in the production of new technologies.
Researchers have used a modernised version of an old experimental geometry dating back to 1911 to measure the exact electronic properties of a domain wall.
The Avalue Technology ARC-1535 and ARC-1538 rugged panel PCs are suitable for operation in harsh environments to help machines work without disruption.
Engineers have created a more efficient and flexible AI chip that has the potential to bring the power of AI into small edge devices.
MIT researchers have developed a chip-free, wireless electronic 'skin' that can send signals related to pulse, sweat and UV exposure without using bulky chips or batteries.
By synthesising a semiconducting material containing tin-based nanoparticles known as quantum dots, a team of researchers have achieved light-power conversion.
Researchers have fabricated intricate optical structures onto the tip of an optical fibre to create a new source of special light beams.