Components

Light-controlled semiconductor device directs electrons

30 July, 2026 by Matt Davenport, University of Michigan News

Researchers have developed a light-controlled semiconductor device that directs electron flow without applied voltage, offering new possibilities for optoelectronic systems.


Ultra-thin transistors pave way for more efficient chips

08 July, 2026

A new transistor design shows that ultra-thin devices can retain performance at nanoscale dimensions, supporting more energy-efficient chip development.


New computational method predicts semiconductor properties

08 July, 2026 by Nik Papageorgiou, EPFL

A study led by EPFL researchers has introduced a new computational method that predicts the electronic properties of semiconductors more accurately, including materials that existing methods can sometimes misclassify as metals.


Advantech SOM-6820 COM Express compact module

01 July, 2026 | Supplied by: Advantech Australia Pty Ltd

The Advantech SOM-6820 is a COM Express Compact Type 6 module with Snapdragon X processors, integrated AI acceleration and industrial-grade support.


Precision-grown nanotubes for next-gen electronics

25 June, 2026

Researchers have used a new synthesis method to produce stable, atomically precise semiconductor nanotubes that could enable next-generation nanoscale electronics.


Advantech AIR-410 and AIR-420 Edge AI high-performance computers

01 June, 2026 | Supplied by: Advantech Australia Pty Ltd

The AIR-410 and AIR-420 Edge AI high-performance computers are designed for data-intensive workloads such as LLMs, medical imaging and automated inspection.


Machine learning advances semiconductor materials research

28 May, 2026 by Flinders University

A new study from Flinders University has demonstrated a faster way to discover semiconductor materials for next-generation computing devices.


Single unit displays flexibility of modular system

21 May, 2026

Researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly into a single unit.


Septentrio mosaic-G5 P6 GNSS module

19 May, 2026 | Supplied by: Digi-Key Electronics

The mosaic-G5 P6 is designed for commercial UAVs, robots and other size- and power-constrained applications.


3D-printed copper plate could transform data centre cooling

14 May, 2026

If used to cool an entire data centre, the technology would contribute only about 1.1% of the centre's total energy usage compared to more than 30% for conventional air-cooling methods.


Chiral semiconductors that can absorb visible light

11 May, 2026 by University at Buffalo

A new system can both absorb visible light and distinguish between left- and right-handed light waves, creating possibilities for optoelectronic technologies.


Pushing the limits of miniaturisation

07 May, 2026

In a process once thought impossible, a tiny memory chip improves as it gets smaller, potentially leading to ultra-efficient smartphones and AI systems.


Advantech SKY-MXM-2000B and 500B modules

01 May, 2026 | Supplied by: Advantech Australia Pty Ltd

Designed for compact systems, these modules deliver high-performance AI processing, real-time computing and high-resolution graphics.


AI workflow accelerates semiconductor materials discovery

22 April, 2026

Researchers from the University of New South Wales have developed an AI-driven system to accelerate the identification of two-dimensional semiconductor materials that can be used in solar cells.


Fungi-based semiconductors for flexible electronics

07 April, 2026 by Hannah Ashton, Oregon State University College of Science

Researchers have harnessed fungi-derived materials to create flexible semiconductors, advancing sustainable electronics that bend, guide light and enable new device designs.


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