Components

Virtual buttons and vibrating touch screens

25 March, 2019

German researchers have developed a film that gives touch screens a third dimension, enabling them to pulse or vibrate on demand.


iBASE IBQ800 low-power CPU module

25 March, 2019 | Supplied by: Backplane Systems Technology Pty Ltd

iBASE's IBQ800 is a highly integrated low-power CPU module powered by an Intel Atom x7-E3950 @2 GHz or x5-E3930 @1.8 GHz processor.


Silicon Labs EFM32 Giant Gecko 12 microcontrollers

22 March, 2019 | Supplied by: Mouser Electronics

The EFM32 Giant Gecko 12 microcontrollers, from Silicon Labs, are designed to provide advanced features and security during ultralow-power performance.


Stacking 2D materials changes their properties

20 March, 2019

When two atomically thin materials like graphene are stacked on top of each other, their properties change and a material with novel hybrid properties emerges.


Teledyne DALSA Z-Trak LP1 3D laser profilers

20 March, 2019 | Supplied by: Adept Turnkey Solutions

Teledyne DALSA has introduced the Z-Trak LP1 series of 3D laser profilers for industrial imaging and factory automation. The profilers deliver precise height measurements in an ergonomically designed compact unit, with a powerful FIR-peak detector.


Renesas Electronics ISL828xM and ISL821xM power modules

20 March, 2019 | Supplied by: Renesas Electronics

The ISL828xM hybrid digital and ISL821xM analog power modules feature integrated LDOs that enable single-supply operation.


X-ES XPedite7683 single-board computer

18 March, 2019 | Supplied by: Metromatics Pty Ltd

Extreme Engineering Solutions (X-ES) introduces the XPedite7683 — a secure, high-performance, 3U OpenVPX single-board computer based on the Intel Xeon D-1500 family of processors.


iBASE FWA8600 1U network appliance

15 March, 2019 | Supplied by: Backplane Systems Technology Pty Ltd

The FWA8600 1U rackmount network security appliance is designed for managing data-driven workloads and enabling robust levels of performance in enterprise network security, unified threat management and WAN optimisation applications.


congatec conga-B7E3 server-on-module

14 March, 2019 | Supplied by: Congatec Australia Pty Ltd

The conga-B7E3 server-on-module with the AMD EPYC Embedded 3000 processor, from congatec, is said to offer up to 52% more instructions per clock compared to legacy architectures.


congatec conga-JC370 3.5″ single-board computer

13 March, 2019 | Supplied by: Congatec Australia Pty Ltd

The conga-JC370 3.5″ single-board computers (SBCs), from congatec, are equipped with commercial-grade 8th Generation Intel Core i7 Mobile processors, codenamed Whiskey Lake.


New forum answers your questions on antenna integration

13 March, 2019

Antenova has introduced an online forum where product designers can consult with industry experts and other designers to get help with integrating antennas and RF into their product designs.


Acromag AcroExpress VPX6860 6U OpenVPX single-board computer

12 March, 2019 | Supplied by: Metromatics Pty Ltd

The VPX6860 series features the 6th Generation Skylake Intel Xeon E3-1505M processor and CM236 PCH chipset for wide-ranging I/O support. Expanded memory performance comes with up to 32 GB of DDR4 ECC SODIMMs that are firmly attached to the board but removable for security or upgrades.


Analog Devices LTM4626 and LTM4638 µModule buck regulators

12 March, 2019 | Supplied by: Mouser Electronics

Analog Devices LTM4626 and LTM4638 µModule regulators offer a 12 or 15 A (respectively) step-down DC/DC regulator solution that incorporates a switching controller, power FETs, inductor and support components.


High-performance n-type transistor developed

12 March, 2019

The unipolar n-type transistor has a high electron mobility performance of up to 7.16 cm2 V−1 s−1, heralding an exciting future for organic electronics.


Vicor PI358x 48V ZVS Buck Regulator

11 March, 2019 | Supplied by: Vicor Corporation

The PI358x series is the latest addition to the Vicor 48V ZVS Buck Regulator portfolio, offering a GQFN package option for the existing LGA and BGA system-in-package (SiP) products.


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