Researchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond that has a high breakdown voltage and low leakage current.
A team of researchers have increased the power of fibre lasers without sacrificing beam quality, offering potential in counterdrone and other technologies.
Researchers have developed a chip-scale mode-locked laser that could enable pocket-sized devices to perform medical imaging, food safety inspection and more.
The ACEPACK DMT-32 silicon carbide power modules from STMicroelectronics combine the features of silicon carbide technology with an optimised, compact design.
The ESP32-C6-WROOM-1 multiprotocol modules from Espressif Systems offer a turnkey solution for adding wireless connectivity to a range of applications.
The Airfast power amplifier modules from NXP Semiconductors are now available from Richardson RFPD. The devices are designed for wireless infrastructure applications that require high performance.