congatec conga-TR4 COM Express Type 6 module
23 February, 2018 by | Supplied by: Congatec Australia Pty Ltdcongatec's conga-TR4 high-performance modules with COM Express Type 6 pinout are based on the latest AMD Ryzen Embedded V1000 multicore processors.
Flexible, comfortable textiles for high-tech clothing
23 February, 2018 byResearchers have developed new nonwoven materials that are electrically conductive as well as flexible and breathable, making them suitable for daily use.
Artila RIO-2017PG C programmable analog-in remote I/O module
21 February, 2018 by | Supplied by: Micromax Pty LtdArtila Electronics has announced the RIO-2017PG, a high-performance, compact, remote I/O module interface with up to eight isolated A/I channels.
Ultrathin 'elastic skin' display developed for home health care
20 February, 2018 byResearchers have invented an ultrathin elastic display that can show the moving waveform of an electrocardiogram recorded by an on-skin electrode sensor that fits snugly on the skin.
MEN G40A NXP ARM Cortex A72 LS1046A CPU module
19 February, 2018 by | Supplied by: OEM Technology SolutionsMEN's G40A is a high-performance and low-power multicore CPU platform, based on an ARM Cortex A72 processor, in CompactPCI Serial form factor.
Maxim Integrated MAX12900 sensor transmitter
15 February, 2018 by | Supplied by: Avnet Electronics MarketingThe MAX12900 is an ultralow-power, highly integrated 4–20 mA sensor transmitter from Maxim Integrated Products, enabling users to create small, low-power designs for industrial automation applications.
Growing 2D crystals for future electronics
14 February, 2018 byGrowing high-quality, crystalline 2D materials at scale has proven a significant challenge for researchers — until now.
MACOM and STMicroelectronics partner on GaN-on-silicon wafers
13 February, 2018 by | Supplied by: STMicroelectronics Pty LtdSTMicroelectronics has agreed with MACOM Technology Solutions, a supplier of high-performance RF, microwave, millimeter-wave and lightwave semiconductor products, to develop GaN (gallium nitride)-on-silicon wafers for the latter's use across an array of RF applications.
Renesas Electronics ISL8274M dual 30 A and ZL9024M single 33 A power modules
06 February, 2018 by | Supplied by: Renesas Electronics Singapore Pte LtdThe dual ISL8274M operates from a 5 or 12 V power rail, provides two 30 A outputs and has up to 95.5% peak efficiency in an 18 x 23 mm2 footprint. The ZL9024M operates from a 3.3 V rail and outputs 33 A of power in a 17 x 19 mm2 footprint.
NXP Semiconductors S32V234 vision and sensor fusion processor
02 February, 2018 by | Supplied by: NXP Semiconductors (Australia & New Zealand)The S32V234 vision and sensor fusion processor, from NXP Semiconductors, is designed to support safe computation-intensive applications in vision and sensor fusion applications.
Fabric-like supercapacitor customisable for wearable electronics
02 February, 2018 byScientists have created a customisable, fabric-like power source that can be cut, folded or stretched without losing its function, making it suitable for wearable electronics.
u-blox SARA R412M LTE Cat M1 and NB-IoT multimode module
30 January, 2018 by | Supplied by: u-blox Singapore Pte Ltdu-blox has announced the SARA‑R412M, an LTE Cat M1, NB-IoT and quad band 2G (EGPRS) module with worldwide coverage. Measuring 16 x 26 mm, the module provides both LTE and quad band EGPRS support in a single design.
Thanks for the memristors
25 January, 2018 byUS scientists have unveiled the inner workings of memristors, which can vary their electrical resistance based on the memory of past activity.
ON Semiconductor RSL10 system-on-chip
23 January, 2018 by | Supplied by: Mouser ElectronicsON Semiconductor's RSL10 multiprotocol system-on-chip (SoC) is designed to bring ultralow-power connectivity to Internet of Things (IoT) devices and high-performance wearables.
Jumping crystals could be exploited in electronics
22 January, 2018 byScientists at The University of Texas at Dallas have observed unusual behaviour in a sample of crystals, in a study published in the journal Chemical Communications.
