Assembly

Atomic-level mechanism discovered for polycrystalline materials

11 October, 2024

Researchers have captured atomic-level observations of grain rotation in polycrystalline materials; their research findings could help develop more efficient electronics.


Liquid immersion cooling system launched in Hong Kong

10 October, 2024

The Hong Kong University of Science and Technology has launched an immersion cooling system to enhance the capacity of high-performance computing devices while reducing energy consumption.


Nature and plastics inspire breakthrough in soft sustainable materials

10 October, 2024 by Amanda Morris, Northwestern University

Biodegradable structures could revolutionize energy, information technologies and advanced medicine.


Quantum computing experts conquer entanglement challenge in silicon chips

03 October, 2024 by University of New South Wales

Researchers have demonstrated the quantum entanglement of two electrons, each bound to a different atom of phosphorus, placed inside a silicon quantum computer chip.


Overcoming magnetic disorder in quantum insulators

12 September, 2024 by Monash University

A Monash-led team has demonstrated that the breakdown in topological protection in quantum insulators is caused by magnetic disorder.


Silicon chip enhances 6G communications

06 September, 2024

A team of scientists has unlocked the potential of 6G communications with a new polarisation multiplexer.


Electric reactor could cut industrial emissions

05 September, 2024 by Laura Castañón, Stanford University

Researchers at Stanford Engineering have developed a new thermochemical reactor that can generate the immense heat needed for industrial processes using electricity instead of fossil fuels.


TTM Technologies XMWT80L1G RF termination

05 September, 2024 | Supplied by: Richardson RFPD

The TTM Technologies XMWT80L1G RF termination is designed to replace larger, bulkier caseless and connectorised terminations.


STMicroelectronics X-CUBE-TCPP software pack

01 September, 2024 | Supplied by: STMicroelectronics Pty Ltd

The STMicroelectronics X-CUBE-TCPP software pack is designed to to simplify product designs by leveraging the USB Power Delivery specification.


An entire brain–machine interface on a chip

29 August, 2024 by Michael David Mitchell, EPFL

Researchers from EPFL have developed a next-generation miniaturised brain–machine interface capable of direct brain-to-text communication on tiny silicon chips.


Smart fabric powers self-sustaining electronics

22 August, 2024 by University of Waterloo

Researchers have developed a smart fabric based on MXene and conductive polymers that can convert body heat and solar energy into electricity.


Computer chips have the potential to become even smaller

22 August, 2024 by Werner Siefer, Paul Scherrer Institute

Researchers at the Paul Scherrer Institute have been improving the resolution of a process known as photolithography, in order to help advance the miniaturisation of computer chips.


Lithium extraction breakthrough: a step towards a greener future

15 August, 2024

Researchers have developed a cheaper and more efficient method of lithium extraction than conventional water-based methods.


VECOW IVX-1000 in-vehicle computing workstation

12 August, 2024 | Supplied by: Backplane Systems Technology Pty Ltd

The VECOW IVX-1000 in-vehicle computing workstation is designed to meet the needs of the mining industry, with software ignition power control and optional UPS support.


Unused Wi-Fi signals could be used to power electronics

09 August, 2024

A team of researchers has come up with a way of harvesting Wi-Fi signals to power small electronic devices.


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