Carbon nanotube design boosts thermoelectric output
22 July, 2026 by Queensland University of Technology (QUT)Self-powered electronics stand to benefit from carbon nanotube engineering that reduces aggregation and improves thermoelectric efficiency.
Smart knits snap into shape as electronic switches
22 July, 2026 by Anne J. Manning, Harvard SEAS CommunicationsHarvard engineers have used standard industrial weft knitting to create dense fabrics that snap between multiple stable 3D shapes, turning ordinary textiles into mechanical metamaterials.
Prototype thin-film electronics dock without connectors
22 July, 2026A bio-inspired docking mechanism allows thin-film electronic modules to assemble autonomously, advancing reconfigurable electronics research.
Quantum heat engine advances scalable computing
15 July, 2026 by Aalto UniversityA new quantum heat engine based on superconducting circuits could support larger quantum computers through improved thermal control and hardware integration.
WOLF Advanced Technology VPX3U-THOR-RD rapid development single board computer
08 July, 2026 | Supplied by: Metromatics Pty LtdThe WOLF VPX3U-THOR-RD single board computer provides advanced AI and high-performance computing capability, high data transfer rates and cybersecurity features for deployed systems.
How reliable is your computer chip?
08 July, 2026Electronic components are becoming smaller and quality control is becoming increasingly difficult. Research from TU Wien shows that established methods fall short and what should be done instead.
EXAIR Dual Hazardous Location Cabinet Cooler Systems
08 July, 2026 | Supplied by: Compressed Air Australia Pty LtdThe Dual Hazardous Location Cabinet Cooler Systems prevent overheating of sensitive electronics while eliminating the need for air conditioners or vortex fans.
Underground cooling for AI data centres
02 July, 2026 by Lois Yoksoulian, University of Illinois Urbana-ChampaignUnderground thermal energy storage could help cool AI data centres while cutting water use and easing the environmental impact of expanding AI infrastructure.
Plastic waste yields battery-grade graphite
02 July, 2026A novel technique converts PET plastic waste into battery-grade graphite, helping reduce landfill waste while supplying a key material for lithium-ion batteries.
Novel surface treatment protects next-gen computer chips
18 June, 2026A new coating technique helps prevent damage during chip fabrication, offering a more reliable path to manufacturing future computer chips.
Rethinking AI hardware with tiny vibrating silicon beams
11 June, 2026Researchers have developed a vibrating-beam device that combines memory and computing, offering a new approach to faster, more energy-efficient AI hardware.
An ultrafast laser on a chip
11 June, 2026 by Nik Papageorgiou, EPFLA new photonic chip from EPFL delivers high-energy femtosecond laser pulses, paving the way for compact optical clocks, sensing and diagnostics.
New method enhances quantum error detection accuracy
10 June, 2026 by University of New South WalesUNSW engineers have developed an adaptive quantum measurement method that reduces readout errors, improving fidelity and supporting quantum error correction.
A new approach to nanoscale heat transfer
03 June, 2026 by Kaitlyn Landram, Carnegie Mellon University College of EngineeringEngineers have demonstrated a new way to boost heat transfer at the nanoscale, a development that could reshape electronics cooling and advanced sensing technologies.
Improving current flow in ultra-thin semiconductors
03 June, 2026Researchers have improved electrical transport in ultra-thin semiconductor devices, offering new insights into the limits of miniaturisation.
