An ultrafast laser on a chip
11 June, 2026 by Nik Papageorgiou, EPFLA new photonic chip from EPFL delivers high-energy femtosecond laser pulses, paving the way for compact optical clocks, sensing and diagnostics.
Rethinking AI hardware with tiny vibrating silicon beams
11 June, 2026Researchers have developed a vibrating-beam device that combines memory and computing, offering a new approach to faster, more energy-efficient AI hardware.
New method enhances quantum error detection accuracy
10 June, 2026 by University of New South WalesUNSW engineers have developed an adaptive quantum measurement method that reduces readout errors, improving fidelity and supporting quantum error correction.
Improving current flow in ultra-thin semiconductors
03 June, 2026Researchers have improved electrical transport in ultra-thin semiconductor devices, offering new insights into the limits of miniaturisation.
A new approach to nanoscale heat transfer
03 June, 2026 by Kaitlyn Landram, Carnegie Mellon University College of EngineeringEngineers have demonstrated a new way to boost heat transfer at the nanoscale, a development that could reshape electronics cooling and advanced sensing technologies.
Monash team demonstrates room-temperature photonic circuit
27 May, 2026A Monash-led study has demonstrated a compact photonic circuit that processes multiple streams of light-based information simultaneously.
Moiré ferroelectric pixels enable next-gen nanoelectronics
04 May, 2026Researchers have demonstrated moiré ferroelectricity in layered nanomaterials, enabling pixel-scale control for next-generation nanoelectronic devices.
METCASE DATAMET wall mount enclosures
01 May, 2026 | Supplied by: ROLEC OKW Australia New Zealand P/LThe METCASE DATAMET wall mount enclosures are suitable for indoor electronic instruments, controls and HMI.
Novel technique for tuning superconductivity levels
21 April, 2026 by Tatyana Woodall, Ohio State UniversityResearchers have developed a technique to tune superconductivity by adjusting a material's environment, enabling control of performance without altering its composition.
AI workloads meet thermal constraints in data centres
16 April, 2026 by Farokh Ghadially, Vice President IT and Data Centres, Schneider ElectricAI growth is straining data centres as rising power use creates intense heat, pushing limits of air cooling and driving a shift to efficient liquid cooling solutions.
Emerson Branson Polaris ultrasonic welding platform
07 April, 2026 | Supplied by: EmersonThe Branson Polaris ultrasonic welding platform delivers a flexible and scalable approach to joining a variety of materials in product packaging.
Adaptive chip design boosts efficiency in electronics
07 April, 2026 by Michelle Cometa, Rochester Institute of TechnologyA new adaptive chip design reduces power use by adjusting performance in real time, boosting efficiency for phones, laptops and other devices.
Brain-inspired AI hardware advances neuromorphic systems
01 April, 2026 by Lindsey Macdonald, Purdue UniversityAutonomous devices can operate more smartly and efficiently thanks to neuromorphic hardware that mimics the brain's way of combining memory and computation.
Flexible films enable next-gen wearable electronics
01 April, 2026Researchers from Queensland University of Technology have developed flexible thermoelectric films that convert body heat into power for next-gen wearables.
NAD Electronics CI modular series
01 April, 2026 | Supplied by: Amber Technology LimitedThe CI modular series from NAD Electronics includes the NAD CI S2 Single Zone Streamer, the NAD CI SA2-120 BluOS Streaming Amplifier and the NAD CI PA4-60 4 Channel Power Amplifier.
