ASMPT SOLO placement head
27 October, 2026 | Supplied by: ASMPT SMT Singapore Pte LtdThe ASMPT SOLO placement head is designed to support large processor BGAs on the SIPLACE SX surface mount assembly platform.
Neural networks enable autonomous drone flight control
22 October, 2026 by Delft University of TechnologyScientists have created an autonomous racing drone using little more than a single forward-facing camera, an inertial measurement unit and a tiny onboard computer.
Biohybrid mesh could power implantable electronics
21 October, 2026 by University of Massachusetts AmherstA flexible biohybrid mesh integrates living human cells with piezoelectric materials to harvest energy, offering a potential new power source for implantable electronics.
New form of magnetism could reshape future chips
21 October, 2026 by Andrew Miller, UCF TodayResearchers have demonstrated experimental evidence of altermagnetism in a layered material, opening a new pathway towards future quantum and spintronic technologies.
Electrical method could help detect extraterrestrial life
07 October, 2026An AI-powered nanogap method can distinguish amino-acid forms, opening a path to compact electrical detectors to search for extraterrestrial life.
On-chip quantum memory enables longer photon storage times
07 October, 2026 by Jeni Bushman, The Grainger College of Engineering at the University of Illinois Urbana-ChampaignResearchers have developed a chip-based quantum memory for longer-term photon storage.
Research identifies hidden network latency bottlenecks
25 September, 2026Researchers have identified hidden network latency bottlenecks, revealing where delays occur and offering new ways to pinpoint performance problems.
Novel semiconductor device enables low-voltage switching
23 September, 2026A gallium oxide-based semiconductor device has demonstrated 0.8 V switching, marking a step towards more energy-efficient chip technologies.
Optical isolators integrated on silicon photonics chips
17 September, 2026A new laser-annealing process integrates optical isolators directly onto silicon photonics chips, supporting more compact optical circuits for high-bandwidth applications.
Neuromorphic chip combines sensing, memory and processing
10 September, 2026 by Will Wright, RMIT UniversityA new neuromorphic vision chip integrates sensing, memory and processing in one system, enabling local data processing with potential energy savings.
Neousys POC-900 Series industrial computing platform
08 September, 2026 | Supplied by: Backplane Systems Technology Pty LtdThe Neousys POC-900 Series is suitable for smart factory, robotics and industrial inspection environments where local processing helps reduce latency.
Cyborg cockroaches carry electronics into disaster zones
03 September, 2026UQ researchers have equipped cockroaches with lightweight electronics, cameras and injectors, creating cyborg rescue platforms for hard-to-reach disaster zones.
ASMPT SIPLACE V assembly platform
03 September, 2026 | Supplied by: ASMPT SMT Singapore Pte LtdThe SIPLACE V assembly platform is designed to handle large and heavy high-performance BGAs, oversized circuit boards and highly miniaturised components.
Laser-patterned polymers enable novel surfaces for electronics
03 September, 2026 by Flinders UniversityA low-power laser process transforms sulfur-based polymers into functional reflective and water-repellent surfaces for potential use in electronics and optical devices.
Hardware implant exposes new risk in aircraft electronics
03 September, 2026 by Ioana Patringenaru, University of California San DiegoComputer science researchers developed and tested a device that, if plugged into a hardwired communications channel connecting two key flight computers, can take over communications between these computers.
