Assembly

Cyborg cockroaches carry electronics into disaster zones

03 September, 2026

UQ researchers have equipped cockroaches with lightweight electronics, cameras and injectors, creating cyborg rescue platforms for hard-to-reach disaster zones.


Hardware implant exposes new risk in aircraft electronics

03 September, 2026 by Ioana Patringenaru, University of California San Diego

Computer science researchers developed and tested a device that, if plugged into a hardwired communications channel connecting two key flight computers, can take over communications between these computers.


ASMPT SIPLACE V assembly platform

03 September, 2026 | Supplied by: ASMPT SMT Singapore Pte Ltd

The SIPLACE V assembly platform is designed to handle large and heavy high-performance BGAs, oversized circuit boards and highly miniaturised components.


Laser-patterned polymers enable novel surfaces for electronics

03 September, 2026 by Flinders University

A low-power laser process transforms sulfur-based polymers into functional reflective and water-repellent surfaces for potential use in electronics and optical devices.


FAULHABER 22GPT LN and 32GPT LN low-noise gearheads

03 September, 2026 | Supplied by: ERNTEC Pty Ltd

The 22GPT LN and 32GPT LN low-noise gearheads are suitable for demanding motion control applications requiring quiet operation without compromising torque output.


Backplane IBASE AGS104L IoT gateway edge computing system

03 September, 2026 | Supplied by: Backplane Systems Technology Pty Ltd

The IBASE AGS104L IoT gateway edge computing system provides a fanless computing platform for industrial automation, remote monitoring and distributed edge deployments.


Hammond Electronics 1557 IP68 polycarbonate enclosures

01 September, 2026 | Supplied by: Hammond Electronics Pty Ltd

The 1557 IP68 polycarbonate enclosures from Hammond Electronics feature environmental sealing to protect the housed equipment against dust and water entry in dirty and damp environments.


How do you measure one-third of an electron?

20 August, 2026 by Nik Papageorgiou, EPFL

EPFL researchers have developed a graphene device that measures the tiny, fractional electric charges carried by some of the strangest objects in quantum physics.


Gas-phase etching for faster MXene manufacturing

13 August, 2026 by Rachel Leeson, Rice University

A gas-phase MXene process cuts etching from hours to seconds, offering faster, more controllable and scalable production for advanced electronics and coatings.


Fuel cell catalyst targets data centre energy needs

12 August, 2026 by Beth Miller, Washington University in St. Louis

A new carbon nanostructure helps platinum–cobalt catalysts remain stable at high temperatures, potentially enabling cleaner power for data centres.


Microwave brain chip compresses satellite data using AI

05 August, 2026 by Syl Kacapyr, Cornell Duffield College of Engineering

The microwave chip can encode signals into an internal language before compressing and classifying data for low-power satellite systems.


Semiconductor chips enable biomolecular sensing

30 July, 2026 by Katherine Connor, University of California San Diego

By integrating insect olfactory receptors with graphene semiconductor chips, researchers have created a bioelectronic platform for selective molecular detection.


Acoustic chip advances 6G and satellite RF systems

29 July, 2026

A novel layered acoustic wave design improves RF power handling and thermal management, enabling more reliable chips for 6G, satellite and future wireless networks.


Carbon nanotube design boosts thermoelectric output

22 July, 2026 by Queensland University of Technology (QUT)

Self-powered electronics stand to benefit from carbon nanotube engineering that reduces aggregation and improves thermoelectric efficiency.


Smart knits snap into shape as electronic switches

22 July, 2026 by Anne J. Manning, Harvard SEAS Communications

Harvard engineers have used standard industrial weft knitting to create dense fabrics that snap between multiple stable 3D shapes, turning ordinary textiles into mechanical metamaterials.


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