Underground cooling for AI data centres
02 July, 2026 by Lois Yoksoulian, University of Illinois Urbana-ChampaignUnderground thermal energy storage could help cool AI data centres while cutting water use and easing the environmental impact of expanding AI infrastructure.
Plastic waste yields battery-grade graphite
02 July, 2026A novel technique converts PET plastic waste into battery-grade graphite, helping reduce landfill waste while supplying a key material for lithium-ion batteries.
Novel surface treatment protects next-gen computer chips
18 June, 2026A new coating technique helps prevent damage during chip fabrication, offering a more reliable path to manufacturing future computer chips.
Rethinking AI hardware with tiny vibrating silicon beams
11 June, 2026Researchers have developed a vibrating-beam device that combines memory and computing, offering a new approach to faster, more energy-efficient AI hardware.
An ultrafast laser on a chip
11 June, 2026 by Nik Papageorgiou, EPFLA new photonic chip from EPFL delivers high-energy femtosecond laser pulses, paving the way for compact optical clocks, sensing and diagnostics.
New method enhances quantum error detection accuracy
10 June, 2026 by University of New South WalesUNSW engineers have developed an adaptive quantum measurement method that reduces readout errors, improving fidelity and supporting quantum error correction.
Improving current flow in ultra-thin semiconductors
03 June, 2026Researchers have improved electrical transport in ultra-thin semiconductor devices, offering new insights into the limits of miniaturisation.
A new approach to nanoscale heat transfer
03 June, 2026 by Kaitlyn Landram, Carnegie Mellon University College of EngineeringEngineers have demonstrated a new way to boost heat transfer at the nanoscale, a development that could reshape electronics cooling and advanced sensing technologies.
Monash team demonstrates room-temperature photonic circuit
27 May, 2026A Monash-led study has demonstrated a compact photonic circuit that processes multiple streams of light-based information simultaneously.
Moiré ferroelectric pixels enable next-gen nanoelectronics
04 May, 2026Researchers have demonstrated moiré ferroelectricity in layered nanomaterials, enabling pixel-scale control for next-generation nanoelectronic devices.
METCASE DATAMET wall mount enclosures
01 May, 2026 | Supplied by: ROLEC OKW Australia New Zealand P/LThe METCASE DATAMET wall mount enclosures are suitable for indoor electronic instruments, controls and HMI.
Novel technique for tuning superconductivity levels
21 April, 2026 by Tatyana Woodall, Ohio State UniversityResearchers have developed a technique to tune superconductivity by adjusting a material's environment, enabling control of performance without altering its composition.
AI workloads meet thermal constraints in data centres
16 April, 2026 by Farokh Ghadially, Vice President IT and Data Centres, Schneider ElectricAI growth is straining data centres as rising power use creates intense heat, pushing limits of air cooling and driving a shift to efficient liquid cooling solutions.
Adaptive chip design boosts efficiency in electronics
07 April, 2026 by Michelle Cometa, Rochester Institute of TechnologyA new adaptive chip design reduces power use by adjusting performance in real time, boosting efficiency for phones, laptops and other devices.
Emerson Branson Polaris ultrasonic welding platform
07 April, 2026 | Supplied by: EmersonThe Branson Polaris ultrasonic welding platform delivers a flexible and scalable approach to joining a variety of materials in product packaging.
