Assembly

Novel method paves the way for unhindered light guidance

18 September, 2025 by Nathi Magubane, University of Pennsylvania

Researchers have developed a system that allows light to be guided through a tiny crystal, undeterred by bumps, bends and back-reflections, paving the way for controllable light-based chips and smarter routing for data links.


Choosing the right surface finish for your PCB

11 September, 2025 by Mohammed Imtiaz Uddin, Napino Auto & Electronics

Choosing the best PCB surface treatment is a crucial step in the PCB design process, to ensure the performance and dependability of electronic devices.


Transforming logistic operations with PoE innovation

11 September, 2025 | Supplied by: Advantech Australia Pty Ltd

Power over Ethernet is being widely adopted in smart buildings, IoT gateways and power-over-data line applications, as it boosts energy efficiency, improves safety and reduces compliance costs.


Custom solutions for complex rack installations

11 September, 2025 | Supplied by: ROLEC OKW Australia New Zealand P/L

There is growing demand for shallow-depth and offset/asymmetrical cases for 19″ rack electronics, as they fit neatly into spaces where conventional symmetrical enclosures would be impractical.


Unlocking the potential of graphene for future electronics

10 September, 2025

Researchers have observed the Floquet effect in graphene, thereby increasing its flexibility and opening the door for advancements in wearable electronics.


ADLINK AmITX-RL-WV Mini-ITX motherboard

09 September, 2025 | Supplied by: ADLINK Technology Inc

The AmITX-RL-WV Mini-ITX motherboard from ADLINK features 12–28V DC input flexibility for deployment in power-variable environments.


Hammond Electronics 1554 and 1555 polycarbonate enclosures

01 September, 2025 | Supplied by: Hammond Electronics Pty Ltd

Hammond Electronics has added reduced height sizes to its 1554, 1555 and 1555F series of polycarbonate enclosures.


Digital to analog in one smooth step

29 August, 2025

Researchers have created an electro-optic digital-to-analog converter that bridges electronic and photonic signals for efficient photonic computing.


Radiation-proof chips built for Large Hadron Collider

15 August, 2025 by Grant Currin, Columbia University School of Engineering and Applied Science

Columbia engineers and physicists partnered with CERN to develop chips that can withstand radiation deep inside the world's largest particle accelerator.


Hybrid photonic-terahertz chip enhances communications

14 August, 2025 by Celia Luterbacher, EPFL

Researchers at EPFL have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device.


Invisible material could enhance smart tech

07 August, 2025

Scientists have developed a transparent, metal-like polymer using hyaluronic acid that could revolutionise wearables, touchscreens and biosensors.


METCASE UNICASE instrument enclosures

01 August, 2025 | Supplied by: ROLEC OKW Australia New Zealand P/L

The METCASE UNICASE series of instrument enclosures now comes in traffic white (RAL 9016), complementing the existing light grey (RAL 7035) and black (RAL 9005) options.


Novel method gives semiconductors a magnetic boost

31 July, 2025 by Wayne Lewis, California NanoSystems Institute at UCLA

Researchers have unveiled a new method for combining magnetic elements with semiconductors; this could pave the way for the next generation of faster and more energy-efficient technologies.


Electronic–photonic quantum chip created in foundry

17 July, 2025

A team of scientists have fabricated a silicon chip, combining quantum light with electronic circuits.


Embedding invisible digital information in printed documents

09 July, 2025

Researchers have developed a system for embedding invisible digital information in printed documents using infrared ink and a special camera.


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