Microwave brain chip compresses satellite data using AI
05 August, 2026 by Syl Kacapyr, Cornell Duffield College of EngineeringThe microwave chip can encode signals into an internal language before compressing and classifying data for low-power satellite systems.
Semiconductor chips enable biomolecular sensing
30 July, 2026 by Katherine Connor, University of California San DiegoBy integrating insect olfactory receptors with graphene semiconductor chips, researchers have created a bioelectronic platform for selective molecular detection.
Acoustic chip advances 6G and satellite RF systems
29 July, 2026A novel layered acoustic wave design improves RF power handling and thermal management, enabling more reliable chips for 6G, satellite and future wireless networks.
Carbon nanotube design boosts thermoelectric output
22 July, 2026 by Queensland University of Technology (QUT)Self-powered electronics stand to benefit from carbon nanotube engineering that reduces aggregation and improves thermoelectric efficiency.
Smart knits snap into shape as electronic switches
22 July, 2026 by Anne J. Manning, Harvard SEAS CommunicationsHarvard engineers have used standard industrial weft knitting to create dense fabrics that snap between multiple stable 3D shapes, turning ordinary textiles into mechanical metamaterials.
Prototype thin-film electronics dock without connectors
22 July, 2026A bio-inspired docking mechanism allows thin-film electronic modules to assemble autonomously, advancing reconfigurable electronics research.
Quantum heat engine advances scalable computing
15 July, 2026 by Aalto UniversityA new quantum heat engine based on superconducting circuits could support larger quantum computers through improved thermal control and hardware integration.
WOLF Advanced Technology VPX3U-THOR-RD rapid development single board computer
08 July, 2026 | Supplied by: Metromatics Pty LtdThe WOLF VPX3U-THOR-RD single board computer provides advanced AI and high-performance computing capability, high data transfer rates and cybersecurity features for deployed systems.
How reliable is your computer chip?
08 July, 2026Electronic components are becoming smaller and quality control is becoming increasingly difficult. Research from TU Wien shows that established methods fall short and what should be done instead.
EXAIR Dual Hazardous Location Cabinet Cooler Systems
08 July, 2026 | Supplied by: Compressed Air Australia Pty LtdThe Dual Hazardous Location Cabinet Cooler Systems prevent overheating of sensitive electronics while eliminating the need for air conditioners or vortex fans.
Plastic waste yields battery-grade graphite
02 July, 2026A novel technique converts PET plastic waste into battery-grade graphite, helping reduce landfill waste while supplying a key material for lithium-ion batteries.
Underground cooling for AI data centres
02 July, 2026 by Lois Yoksoulian, University of Illinois Urbana-ChampaignUnderground thermal energy storage could help cool AI data centres while cutting water use and easing the environmental impact of expanding AI infrastructure.
Novel surface treatment protects next-gen computer chips
18 June, 2026A new coating technique helps prevent damage during chip fabrication, offering a more reliable path to manufacturing future computer chips.
An ultrafast laser on a chip
11 June, 2026 by Nik Papageorgiou, EPFLA new photonic chip from EPFL delivers high-energy femtosecond laser pulses, paving the way for compact optical clocks, sensing and diagnostics.
Rethinking AI hardware with tiny vibrating silicon beams
11 June, 2026Researchers have developed a vibrating-beam device that combines memory and computing, offering a new approach to faster, more energy-efficient AI hardware.
