Assembly

OKW EVOTEC 250 enclosure for contemporary desktop applications

01 September, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/L

The EVOTEC 250, with the dimensions 250 x 155 x 54 mm, is the latest addition to the EVOTEC enclosure range. The product offers sufficient space for the installation of 5.7″ displays with or without touch-screen function.


Nano Dimension DragonFly 2020 3D PCB printer

15 August, 2017 | Supplied by: Emona Instruments Pty Ltd

Nano Dimension has developed the DragonFly 2020 3D PCB printer for printing professional multilayer circuit boards.


WAGO 297 Series through-board SMD PCB terminal block

11 August, 2017 | Supplied by: WAGO Pty Ltd

WAGO's 297 Series is a through-board SMD PCB terminal block for conductor cross-sections of 0.5 mm2 (20 AWG).


Hammond Electronics Pole Mounting Kits

01 August, 2017 | Supplied by: Hammond Electronics Pty Ltd

Hammond Electronics has introduced an initial five sizes of its Pole Mounting Kit, which enable three sealed enclosure families to be attached to round, square or rectangular poles with diameters from 38 to 381 mm.


ROLEC aluCASE enclosures with IP69K protection

01 August, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/L

ROLEC's aluCASE diecast aluminium enclosures are now available with an optional IP69K rating to protect electronics from high-pressure jet washing and steam cleaning.


Protecting POS terminals from attack

25 July, 2017

Three-dimensional moulded interconnect devices (3D-MIDs) are increasingly being used by manufacturers of POS terminals to improve security standards and fend off hacker attacks.


How to master power density for motor drives

19 July, 2017 by Stefan Hopfe* and Stefan Häuser^ | Supplied by: Semikron Pty Ltd

How can motor drive costs be optimised? The answer is by improving the power density through reducing the thermal impedance of the power system.


Rehm VXC series convection reflow systems

13 July, 2017 | Supplied by: Onboard Solutions

Rehm's VXC series convection reflow systems offer optimised heat transfer and thermal stability, with low real-world cross-profile performance, low MTBF and low power usage.


Extra Eye First Article Inspection process

12 July, 2017 | Supplied by: Onboard Solutions

Extra Eye's automated First Article Inspection process is said to be much faster than manual inspection. With set-up in minutes and easy operation, the process provides an alternative to automatic optical inspection (AOI) for low-volume series.


Rehm Thermal Systems Condenso XC Batch Vacuum Reflow System

11 July, 2017 | Supplied by: Onboard Solutions

The Condenso XC Batch Vacuum Reflow System is suitable for high-technology, large thermal mass, difficult soldering applications.


Hi-Q Components nylon 6/6 components for plastic circuit boards

10 July, 2017 | Supplied by: Hi-Q Electronics Ltd

Hi-Q Components stocks a large range of nylon 6/6 components commonly used in circuit board manufacturing. Nylon 6/6 is suitable for circuit board applications due to its chemical resistance, electrical insulation and high tensile strength.


Innovative enclosures for Industry 4.0

10 July, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/L

The development to Industry 4.0 affects the design and performance of enclosures for the installation of control units. As an enclosure specialist, ROLEC has incorporated these requirements into its current range.


Sun Industries Hybrid decals

07 July, 2017 | Supplied by: Sun Industries Pty Ltd

By incorporating digital processes into its graphics manufacturing, Sun Industries is able to offer full customisation of users' decals with durability characteristics.


DuPont and TactoTek collaborate on in-mould electronics

06 July, 2017 | Supplied by: DuPont (Aust) Limited

DuPont Electronics and Communications is collaborating with TactoTek, a designer and producer of injection-moulded electronics (IME), to meet the growing demand for IME solutions.


Tarapath Beta 300 2T benchtop moulding machine

06 July, 2017 | Supplied by: Tarapath Pty Ltd

The Beta 300 2T benchtop moulding machine processes the Technomelt range of materials to encapsulate and overmould various electronics, protecting them from environmental factors such as moisture, dust and vibration.


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