Radiation-proof chips built for Large Hadron Collider
15 August, 2025 by Grant Currin, Columbia University School of Engineering and Applied ScienceColumbia engineers and physicists partnered with CERN to develop chips that can withstand radiation deep inside the world's largest particle accelerator.
Hybrid photonic-terahertz chip enhances communications
14 August, 2025 by Celia Luterbacher, EPFLResearchers at EPFL have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device.
Invisible material could enhance smart tech
07 August, 2025Scientists have developed a transparent, metal-like polymer using hyaluronic acid that could revolutionise wearables, touchscreens and biosensors.
METCASE UNICASE instrument enclosures
01 August, 2025 | Supplied by: ROLEC OKW Australia New Zealand P/LThe METCASE UNICASE series of instrument enclosures now comes in traffic white (RAL 9016), complementing the existing light grey (RAL 7035) and black (RAL 9005) options.
Novel method gives semiconductors a magnetic boost
31 July, 2025 by Wayne Lewis, California NanoSystems Institute at UCLAResearchers have unveiled a new method for combining magnetic elements with semiconductors; this could pave the way for the next generation of faster and more energy-efficient technologies.
Electronic–photonic quantum chip created in foundry
17 July, 2025A team of scientists have fabricated a silicon chip, combining quantum light with electronic circuits.
Embedding invisible digital information in printed documents
09 July, 2025Researchers have developed a system for embedding invisible digital information in printed documents using infrared ink and a special camera.
Next-gen adhesive technology for micro-LED displays
03 July, 2025Researchers have developed a novel dry adhesive technology that allows microscale LED components to be easily attached and detached.
EXAIR ATEX cabinet cooler systems
02 July, 2025 | Supplied by: Compressed Air Australia Pty LtdThe ATEX Cabinet Cooler Systems are designed to keep electrical enclosures cool in hazardous ATEX classified areas.
Engineering ultra-thin magnets for next-gen electronics
27 June, 2025 by University of OttawaResearchers have developed ultra-thin magnets that could facilitate the development of faster, more energy-efficient electronics and communication systems.
Researchers crack scalable CMOS quantum computing
26 June, 2025Researchers from the University of Sydney have developed a cryogenic CMOS chip capable of controlling spin qubits at temperatures close to absolute zero.
Evaporative cooling tech could cut data centre energy use
18 June, 2025 by Liezel Labios, UC San Diego Jacobs School of EngineeringResearchers have developed a new evaporative cooling technology that could improve the energy efficiency of data centres and high-powered electronics.
Semiconductor advance paves the way for faster electronics
17 June, 2025Researchers have developed a streamlined method for growing tin sulfide (SnS), a semiconductor material with potential applications in next-gen electronics.
Novel decentralised AI chip works without the cloud
28 May, 2025Researchers have developed a new AI chip that works without the cloud server or internet connections needed by existing chips.
3D printing tech improves durability of 'smart wearables'
22 May, 2025 by Shawn Vestal, Washington State UniversityResearchers have developed a 3D printing method for smart fabrics that maintains performance after repeated washing and wear.
