Assembly

Evaporative cooling tech could cut data centre energy use

18 June, 2025 by Liezel Labios, UC San Diego Jacobs School of Engineering

Researchers have developed a new evaporative cooling technology that could improve the energy efficiency of data centres and high-powered electronics.


Semiconductor advance paves the way for faster electronics

17 June, 2025

Researchers have developed a streamlined method for growing tin sulfide (SnS), a semiconductor material with potential applications in next-gen electronics.


Novel decentralised AI chip works without the cloud

28 May, 2025

Researchers have developed a new AI chip that works without the cloud server or internet connections needed by existing chips.


3D printing tech improves durability of 'smart wearables'

22 May, 2025 by Shawn Vestal, Washington State University

Researchers have developed a 3D printing method for smart fabrics that maintains performance after repeated washing and wear.


Understanding thermal management in electronics

01 May, 2025 | Supplied by: Active Components (NZ) Ltd

The thermal management of electronic circuits plays a significant role in reducing the operating temperature to an allowable value.


Advantech HMI TPC-100W series panel PC

01 May, 2025 | Supplied by: Advantech Australia Pty Ltd

The Advantech HMI TPC-100W series panel PC features Secure Boot, to prevent unauthorised firmware and malicious code.


Sound waves enhance nonlinearity in photonic computing

30 April, 2025 by Max Planck Institute for the Science of Light

Scientists have demonstrated that sound waves can serve as mediators for effective photonic activation functions.


New method to stop electronics from overheating

23 April, 2025 by University of Virginia School of Engineering and Applied Science

Researchers have discovered an innovative method to keep electronic devices cooler for longer.


Novel, non-toxic synthesis method for MXene

23 April, 2025 by Pierluigi Bilotto, TU Wien

MXene, a nanomaterial used in battery technology, can be difficult and hazardous to produce. Now, researchers have developed safer methods for its production.


A surprise contender for cooling computers: lasers

16 April, 2025 by Troy Rummler, Sandia National Laboratories

Laser cooling company Maxwell Labs has partnered with Sandia National Laboratories to develop laser-based photonic cooling for high-density data centre processors.


Metcase Technomet-Control HMI enclosures

02 April, 2025 | Supplied by: ROLEC OKW Australia New Zealand P/L

The Technomet-Control HMI enclosures from Metcase feature a mounting bracket (accessory) for poles and masts ⌀50 mm or larger.


Terahertz wave control for enhanced wireless technology

27 March, 2025

Researchers have developed a new patterned spintronic emitter that enables room-temperature control of terahertz wave polarisation.


FUJI Smart Factory Platform NXTR A model

21 March, 2025 | Supplied by: Kobot Systems

The NXTR A model pick and place machine is designed to enhance productivity, maintain high-quality standards and reduce the need for manual intervention.


Epoxy Technology Hybrid 353ND

19 March, 2025 | Supplied by: Onboard Solutions

The Epoxy Technology Hybrid 353ND is suitable for bonding, sealing and coating applications in electronic assembly.


BDTronic Mini Dis micro dispensing system

19 March, 2025 | Supplied by: Onboard Solutions

The micro dispensing system is designed to dispense adhesives, sealants and conductive materials, making it suitable for microelectronics and medical applications.


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