Assembly

Four strategies to strengthen subassembly sourcing

20 October, 2016 by Ed Sullivan*

Selecting subassembly manufacturers with specific capabilities can speed turnaround, improve product performance and functionality, and increase an OEM's bottom line.


HMicro HC1100 wearable wireless biosensor chip

12 October, 2016 | Supplied by: STMicroelectronics Pty Ltd

HMicro and STMicroelectronics have launched a cooperation to create a single-chip solution for clinical-grade, single-use disposable smart patches and biosensors.


Hammond Electronics 1590 die-cast enclosures

01 September, 2016 | Supplied by: Hammond Electronics Pty Ltd

The 1590 die-cast enclosures family from Hammond Electronics consists of 41 different sizes in the standard rectangular and STOMP Box painted variants.


Making a splash in water-resistant digital devices

26 August, 2016

The trend in consumer electronics has always been to make them faster, smarter and with ever-expanding capabilities. But waterproofing has become the new focus of global electronics manufacturers and most brands are rushing to include this benefit to ensure they are not left behind in this ultracompetitive market.


ROLEC enclosures IP67/IP69K protection class upgrades

25 August, 2016 | Supplied by: ROLEC OKW Australia New Zealand P/L

ROLEC now offers its diecast aluminium enclosures with the option of factory-fitted IP protection class upgrades. Depending on the type of enclosure, the ratings can be increased from IP66 to IP67 and from IP67 to IP69K.


Lintek HDI multilayer printed circuit boards

28 July, 2016 | Supplied by: Lintek Pty Ltd

Lintek is offering its clients copper-filled 'via in pad' technology for BGA devices down to 0.35 mm pitch. The company provides blind, buried and castellated vias on multilayer circuit boards manufactured on a wide variety of dielectrics.


Thermaltronics CHT soldering irons

11 July, 2016 | Supplied by: Soanar Limited

Thermaltronics' soldering irons, based on Curie Heat Technology (CHT), respond to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. In addition, the soldering hand-piece instantly heats and cools upon removing and replacing from its holder.


ASSCON MultiVacuum vacuum soldering process

08 July, 2016 | Supplied by: Suba Engineering

In the MultiVacuum process, PCBs are subjected to several vacuum applications during the soldering stages, with the option of applying vacuum both before and during the melting of the solder paste.


Hammond 1551USB miniature enclosures

29 June, 2016 | Supplied by: Hammond Electronics Pty Ltd

To house small PCBs using USB as the external power and signal interconnect, Hammond Electronics is launching more sizes of its 1551 miniature family. They are 35, 50 or 65 mm long, 20, 25 or 30 mm wide and all 15.5 mm high.


congatec conga-IC170 industrial-grade Thin Mini-ITX board

29 June, 2016 | Supplied by: Congatec Australia Pty Ltd

congatec has introduced the Thin Mini-ITX boards with Intel processors with high scalability, ranging from 2 GHz Intel Celeron processors up to 3.4 GHz Intel Core i7 processors.


QualiEco Circuits express PCB and assembly services

23 June, 2016 | Supplied by: QualiEco Circuits Ltd

QualiEco Circuits provides quality electronic manufacturing services and solutions. The company offers express services in all product categories, with customised delivery solutions.


Keysight Technologies M9019A Gen 3 PXIe 18-slot chassis

20 June, 2016 | Supplied by: Keysight Technologies Australia Pty Ltd

Keysight Technologies has announced a Gen 3 PXIe chassis and set of Gen 3 system components designed for complex, high-performance applications.


Device-to-device communication outside LTE service areas

03 June, 2016 | Supplied by: NEC Australia Pty Ltd

NEC Corporation has announced device-to-device communication technology that enables emergency response personnel to transmit high-quality images from the scene of a disaster or accident when outside of the service area of the public safety long-term evolution (PS-LTE) network.


LPMS Beta 300 low-pressure moulding machine

01 June, 2016 | Supplied by: Tarapath Pty Ltd

The LPMS Beta 300 is a low-pressure moulding machine for small-, medium- or high-volume production. It enables the efficient encapsulation of various electronics including PCBAs, cable connections, connector terminations and other items.


Electrolube Safewash Total aqueous cleaner

23 May, 2016 | Supplied by: Electrolube

Safewash Total provides cleaning performance to military cleanliness standards (ANSI-J-001B/IPC TM-650) at minimal environmental cost. Designed for cleaning printed circuit boards, the cleaner is suitable for the removal of leaded, lead-free and no-clean flux residues.


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