The Xilinx Kintex UltraScale XCKU085/115 PCIe FPGA carrier board is designed to meet the needs of challenging embedded high-performance digital signal processing.
The RS Components RS Pro range of painted die-cast aluminium enclosures is designed for use where there is a potentially explosive atmosphere.
The congatec conga-IC175 Thin Mini-ITX thin industrial-grade motherboard features the 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices.
Advantech has announced the AIMB-216, an industrial-grade fanless Thin Mini-ITX motherboard. With Intel Pentium/Celeron N3710/N3160/N3010 processor support, plus the latest Intel 14 nm technology, it offers significant CPU and graphics performance improvements with low power consumption.
EXAIR's Ion Air Cannon eliminates static electricity and cleans at distances up to 4.6 m, with no moving parts. It is suitable for benchtops, machine mounting and those hard-to-reach spaces that require a concentrated flow of static-eliminating ions.
Singaporean researchers have 3D-printed a ready-to-fly drone with embedded electronics using aerospace-grade material.
Screen Process Circuits die cut and laser cut gaskets can be manufactured in many shapes, sizes and thicknesses and from a variety of different materials to meet sealing requirements.
OKW Gehäusesysteme has a versatile range of design-oriented plastic enclosures and tuning knobs. However, the requirement for customisation can also be fulfilled by the company's in-house service centre.