[White paper] COM-HPC Mini — a game changer in the electronics space
Supplied by Congatec on Wednesday, 20 November, 2024
The COM-HPC specification 1.2 is now ratified, introducing COM-HPC Mini to the market. First modules based on this spec are available. Since modules alone don't provide OEMs with the agility to optimize and expand their solutions, a next-gen COM-HPC ecosystem was created, helping developers of ultra-compact high-performance systems solve the challenge of fitting high performance into a mini footprint.
Learn how the COM-HPD mini module is set to revolutionize electronic manufacturing. Discover how to harness this latest technology to enhance your electronic products.
How to build a smarter ultra-wide DC-DC converter
Learn how to design an ultra-wide DC-DC converter using multiple parts and maximise your...
How to solve SWaP-C challenges with 270 V input applications
Defence applications with 270 VDC input must meet stringent EMI, environmental and power-related...
Advanced 3-level topologies for solar applications
Learn about 3-Level topologies, future trends in the solar sector and requirements.
