Latest Articles

Introducing the new soon to be launched Digilent ADP2440 and ADP2450

The Digilent ADP2440 and ADP2450 USB‑based mixed signal oscilloscopes are designed for modern prototyping, research and validation.

Test & measure 12 March, 2026

Photonic AI chip processes data at the speed of light

Aussie researchers have built an ultra-compact nanophotonic AI chip that performs neural network calculations using light instead of electricity, enabling computation at...

Components 11 March, 2026

Detecting ‘mouse bite’ defects in semiconductors

Cornell researchers have used advanced electron microscopy to identify atomic-scale ‘mouse bite’ defects in 3D transistors.

Components 05 March, 2026

Reducing PCB assembly lead times without increasing risk

How subcontract manufacturers can reduce PCB assembly lead times through better documentation, component planning and cross-functional collaboration.

Assembly 01 March, 2026

Safeguard pocket electronics with smart compact enclosures

Considering ergonomics, functionality, size, weight, durability and aesthetics when selecting enclosures for pocket-sized devices.

Assembly 01 March, 2026

Featured Products
Featured Products
Business
Avoiding EMC issues: simple tests you can do yourself

Avoiding EMC issues: simple tests you can do yourself

This is a brief overview of EMC compliance with some practical tips on not getting caught out.

Article 02 May, 2025
Components
Photonic AI chip processes data at the speed of light

Photonic AI chip processes data at the speed of light

Aussie researchers have built an ultra-compact nanophotonic AI chip that performs neural network calculations using light instead of electricity,...

Article 11 March, 2026
Data acquisition
Wireless innovation transmits vast amounts of data

Wireless innovation transmits vast amounts of data

Researchers have developed a machine-learning system that curves ultrahigh-frequency signals around obstacles, solving a barrier to sub-terahertz...

Article 21 August, 2025
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