Top five innovative printed/flexible sensor technologies
Printed/flexible sensors can measure a wide range of parameters and can be employed in emerging applications, including IIoT, wearables, automotive interiors and smart...
2D materials integrated into semiconductor manufacturing lines
Europe's Graphene Flagship has reported a new method to integrate graphene and 2D materials into semiconductor manufacturing lines.
Vision-guided artificial skin gives robots a sense of touch
Researchers have constructed a 3D vision-guided artificial skin for robots that enables tactile sensing with high performance, opening doors to several applications.
Interactive phone holder wins 2020 NFC Innovation Contest
The 2020 ST NFC Innovation Contest was a new initiative from STMicroelectronics that encouraged engineers and enthusiasts to shape the industry.
High-capacity magnetic tape developed for the big data era
The latest development in magnetic tape technology should see magnetic tapes with 10 times the current capacities within five to 10 years.
NEMA 4X 316SS Cabinet Coolers for tight spaces
EXAIR's Type 316 Side Mount Kits make the mounting of a NEMA 4X Cabinet Cooler possible when...
P-DUKE QAE100U Ultrawide Input DC/DC Converters
Helios has announced the QAE100U series DC/DC converters from P-DUKE, which expand the existing...

Top 5 green materials for electronics
While it may be cheaper to use materials considered to be more toxic, many electronics producers are choosing to invest in greener materials.
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Competition to communicate technological innovations
The Communications Prizes seek to find the most compelling technological and engineering...
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Electronex rescheduled to September 2021
Electronex – The Electronics Design & Assembly Expo, which was to be held in May this...
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STMicroelectronics joins the ZETA Alliance
STMicroelectronics has joined the ZETA Alliance, the industry body promoting ZETA low-power...
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2D materials integrated into semiconductor manufacturing lines
Europe's Graphene Flagship has reported a new method to integrate graphene and 2D materials into semiconductor manufacturing lines.
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Low levels of backscattering confirmed in hollow-core fibres
Researchers have successfully measured back-reflection in cutting-edge hollow-core fibres that is...
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Ferroelectric memory with ultralow power and high speed
A new ferroelectric memory surpasses the performance of a conventional flash memory in terms of...
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Biodegradable displays enable eco-friendly electronics
German scientists have produced electronic displays whose biodegradability has been checked and...
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High-capacity magnetic tape developed for the big data era
The latest development in magnetic tape technology should see magnetic tapes with 10 times the current capacities within five to 10 years.
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Enhancing the energy efficiency of magnetic RAM
Researchers have demonstrated a new way to enhance the energy efficiency of a non-volatile...
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New file format released for 3D printers
A newly published standard is expected to help realise the full potential of additive manufacturing.
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Extending the life of acoustic waves on microchips
Scientists have taken an important step towards removing electrons from the data chips that are a...
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