Omron Electronic Components has released a compact and easy-to-mount human vision component to provide an image sensing capability to various devices. Known as the HVC-P2, it has a maximum recognition speed 10 times of the original HVC model.
Teledyne DALSA has announced the Genie Nano-CXP series of CMOS area scan cameras. The image CMOS sensors range from 16–67 MP resolution with added CoaXPress 6.25 Gbps technology offering high speed, robust build quality for wide operating temperature, and a substantial feature set.
A high-throughput computational method developed at UC San Diego has generated 13 new material candidates for solar cells and 23 new candidates for LEDs.
The Nordson DAGE Explorer one is a compact X-ray inspection system that has been designed specifically for the electronics industry. The product's high image quality allows features as small as 2 µm to be seen.
As data science continues to grow and evolve, new challenges are cropping up that companies must address as they move projects forward.
New sensor technology should allow for infrared cameras just one-eighth the size of previous models to be able to take detailed images even at night or at a distance.
Seeking a solution for comfortable wearable electronics, Chinese researchers have developed a way to simply print flexible fibres onto transitional textiles or clothes.
Thermo Fisher Scientific has released its latest focused ion beam scanning electron microscope (FIB-SEM) for nanometre-scale materials characterisation and analysis, the Thermo Scientific Helios 5 DualBeam microscope.
A new quantum computer program can detect the presence of 'leakage', where information being processed by a quantum computer escapes from the states of 0 and 1.
NetComm has expanded its Industrial Internet of Things (IIoT) portfolio with the launch of the NTC-220 4G LTE Category 1 Industrial IoT Router, which will deliver secure medium-bandwidth connectivity using universally available LTE networks.
Researchers are developing an eco-friendly, 3D-printable solution for producing wireless IoT sensors that can be used and disposed of without contaminating the environment.