STMicroelectronics STM32C071 graphical user interface
01 November, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics STM32C071 graphical user interface features 128 KB of flash and 24 KB of RAM, enabling users to drive a 320 x 240 display using an SPI interface.
OKW SOLID-BOX enclosures
01 November, 2024 | Supplied by: ROLEC OKW Australia New Zealand P/LThe OKW SOLID-BOX enclosures feature IK08 impact protection and a high IP66/67 protection rating, making them suitable for a range of harsh environments.
Advantech MIC-770 V3 Extreme SKU
01 November, 2024 | Supplied by: Advantech Australia Pty LtdThe Advantech Advantech MIC-770 V3 Extreme SKU provides enhanced performance in environments where traditional airflow-based cooling systems are not feasible.
Quectel QLM29H Series GNSS receiver
31 October, 2024 | Supplied by: QuectelThe Quectel QLM29H Series GNSS receiver combines the LC29H GNSS module and an integrated GNSS patch antenna to simplify RF design.
Researchers explore potential of MXenes for nanotech applications
31 October, 2024 by Dan Moser, University of Nebraska-LincolnScientists are exploring the physical properties of MXenes, a family of two-dimensional materials with the potential for many nanotechnology applications.
e-Flower records neuronal activity with electronic petals
25 October, 2024 by Michael David Mitchell, EPFLResearchers have developed a novel neural recording device called the 'e-Flower' that gently wraps organoids in soft petals.
Earthquake on a chip
24 October, 2024 by Sydney UniversityResearchers have used sound and lightwaves to create a new generation of high-tech devices in sensing and communications technology.
Thinner materials for more compact quantum computing devices
17 October, 2024Researchers from NTU Singapore have used very thin materials to produce entangled pairs of photons that can be used as quantum bits for computing.
Atomic-level mechanism discovered for polycrystalline materials
11 October, 2024Researchers have captured atomic-level observations of grain rotation in polycrystalline materials; their research findings could help develop more efficient electronics.
Liquid immersion cooling system launched in Hong Kong
10 October, 2024The Hong Kong University of Science and Technology has launched an immersion cooling system to enhance the capacity of high-performance computing devices while reducing energy consumption.
Nature and plastics inspire breakthrough in soft sustainable materials
10 October, 2024 by Amanda Morris, Northwestern UniversityBiodegradable structures could revolutionize energy, information technologies and advanced medicine.
Quantum computing experts conquer entanglement challenge in silicon chips
03 October, 2024 by University of New South WalesResearchers have demonstrated the quantum entanglement of two electrons, each bound to a different atom of phosphorus, placed inside a silicon quantum computer chip.
Overcoming magnetic disorder in quantum insulators
12 September, 2024 by Monash UniversityA Monash-led team has demonstrated that the breakdown in topological protection in quantum insulators is caused by magnetic disorder.
Silicon chip enhances 6G communications
06 September, 2024A team of scientists has unlocked the potential of 6G communications with a new polarisation multiplexer.
Electric reactor could cut industrial emissions
05 September, 2024 by Laura Castañón, Stanford UniversityResearchers at Stanford Engineering have developed a new thermochemical reactor that can generate the immense heat needed for industrial processes using electricity instead of fossil fuels.
