Assembly

Unlocking the potential of graphene for future electronics

10 September, 2025

Researchers have observed the Floquet effect in graphene, thereby increasing its flexibility and opening the door for advancements in wearable electronics.


ADLINK AmITX-RL-WV Mini-ITX motherboard

09 September, 2025 | Supplied by: ADLINK Technology Inc

The AmITX-RL-WV Mini-ITX motherboard from ADLINK features 12–28V DC input flexibility for deployment in power-variable environments.


Hammond Electronics 1554 and 1555 polycarbonate enclosures

01 September, 2025 | Supplied by: Hammond Electronics Pty Ltd

Hammond Electronics has added reduced height sizes to its 1554, 1555 and 1555F series of polycarbonate enclosures.


Digital to analog in one smooth step

29 August, 2025

Researchers have created an electro-optic digital-to-analog converter that bridges electronic and photonic signals for efficient photonic computing.


Radiation-proof chips built for Large Hadron Collider

15 August, 2025 by Grant Currin, Columbia University School of Engineering and Applied Science

Columbia engineers and physicists partnered with CERN to develop chips that can withstand radiation deep inside the world's largest particle accelerator.


Hybrid photonic-terahertz chip enhances communications

14 August, 2025 by Celia Luterbacher, EPFL

Researchers at EPFL have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device.


Invisible material could enhance smart tech

07 August, 2025

Scientists have developed a transparent, metal-like polymer using hyaluronic acid that could revolutionise wearables, touchscreens and biosensors.


METCASE UNICASE instrument enclosures

01 August, 2025 | Supplied by: ROLEC OKW Australia New Zealand P/L

The METCASE UNICASE series of instrument enclosures now comes in traffic white (RAL 9016), complementing the existing light grey (RAL 7035) and black (RAL 9005) options.


Novel method gives semiconductors a magnetic boost

31 July, 2025 by Wayne Lewis, California NanoSystems Institute at UCLA

Researchers have unveiled a new method for combining magnetic elements with semiconductors; this could pave the way for the next generation of faster and more energy-efficient technologies.


Electronic–photonic quantum chip created in foundry

17 July, 2025

A team of scientists have fabricated a silicon chip, combining quantum light with electronic circuits.


Embedding invisible digital information in printed documents

09 July, 2025

Researchers have developed a system for embedding invisible digital information in printed documents using infrared ink and a special camera.


Next-gen adhesive technology for micro-LED displays

03 July, 2025

Researchers have developed a novel dry adhesive technology that allows microscale LED components to be easily attached and detached.


EXAIR ATEX cabinet cooler systems

02 July, 2025 | Supplied by: Compressed Air Australia Pty Ltd

The ATEX Cabinet Cooler Systems are designed to keep electrical enclosures cool in hazardous ATEX classified areas.


Engineering ultra-thin magnets for next-gen electronics

27 June, 2025 by University of Ottawa

Researchers have developed ultra-thin magnets that could facilitate the development of faster, more energy-efficient electronics and communication systems.


Researchers crack scalable CMOS quantum computing

26 June, 2025

Researchers from the University of Sydney have developed a cryogenic CMOS chip capable of controlling spin qubits at temperatures close to absolute zero.


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