The Epoxy Technology Hybrid 353ND is an advanced UV- and heat-curable hybrid epoxy that is designed to deliver good adhesion and mechanical performance. Suitable for bonding, sealing and coating applications in electronic assembly, the hybrid epoxy offers flexibility and strength.
A single component, the high-temperature hybrid epoxy is also suitable for semiconductor and fibre-optic applications. It is designed to have similar cured performance to EPO-TEK 353ND, modified to allow for initial UV tacking.
The epoxy features a Dual Cure System with UV and secondary heat cure mechanism for fast processing and enhanced performance. The epoxy bonds to a variety of substrates, including metals, ceramics and plastics. Its low outgassing and high purity make it suitable for optical and medical applications.
Other applications for the epoxy include semiconductor packaging and die attach, fibre bonding and component alignment, piezo electric bonding, LiDAR and IR sensors, and optical and medical device assembly.
Phone: 02 9695 1030
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