ASMPT SIPLACE V assembly platform

With the SIPLACE V assembly platform, ASMPT has developed a new generation of placement machines that enables productivity increases under real-life conditions in several key industries while also meeting the rising requirements of modern electronics applications, such as AI server boards. It can handle large and heavy high-performance BGAs, oversized circuit boards and highly miniaturised components down to the 016008M size factor precisely and efficiently.

With a compact footprint of just 1.5 x 2.4 m, the placement platform processes odd-shaped components (OSCs) up to 55 mm in height. Existing SIPLACE X feeders and even changeover tables from the SIPLACE SX can continue to be used, providing electronics manufacturers with a high level of investment protection. An enhanced Smart Pin Support, increased maximum PCB size and a flexibly interchangeable tray changer further expand application versatility and simplify adaptation to changing production requirements.