ASMPT SOLO placement head

With its new SOLO placement head, ASMPT SMT Solutions has expanded its range of solutions for the production of complex circuit boards for AI and high-performance computing (HPC) applications. Developed for the placement of large and heavy processor BGAs, the new head can initially be used on the SIPLACE SX. It handles components measuring up to 240 x 240 millimetres (9.45 x 9.45 inches) and weighing over 2 kilograms (4.4 pounds), soon to be increased to up to 5 kilograms (11 pounds).

The SOLO head is designed for picking and placing processor BGAs of this size and weight class. It is based on a new single-segment architecture with a strengthened and stiffened axis. The connection between the placement head and the gantry as well as the interface between nozzle and segment were also designed to withstand greater mechanical loads. The maximum placement force is 200 newtons.