Three-dimensional moulded interconnect devices (3D-MIDs) are increasingly being used by manufacturers of POS terminals to improve security standards and fend off hacker attacks.
Extra Eye's automated First Article Inspection process is said to be much faster than manual inspection. With set-up in minutes and easy operation, the process provides an alternative to automatic optical inspection (AOI) for low-volume series.
The Condenso XC Batch Vacuum Reflow System is suitable for high-technology, large thermal mass, difficult soldering applications.
Hi-Q Components stocks a large range of nylon 6/6 components commonly used in circuit board manufacturing. Nylon 6/6 is suitable for circuit board applications due to its chemical resistance, electrical insulation and high tensile strength.
The development to Industry 4.0 affects the design and performance of enclosures for the installation of control units. As an enclosure specialist, ROLEC has incorporated these requirements into its current range.
DuPont Electronics and Communications is collaborating with TactoTek, a designer and producer of injection-moulded electronics (IME), to meet the growing demand for IME solutions.
The Beta 300 2T benchtop moulding machine processes the Technomelt range of materials to encapsulate and overmould various electronics, protecting them from environmental factors such as moisture, dust and vibration.
Software company Neurotechnology is developing ultrasonic technology that will enable the 3D printing and assembly of almost any type of object using a wide range of different materials and components.
Electrolube has developed an innovative cleaning solution called Safewash Super (SWAS) for PCB wafer assemblers, following close collaboration with a number of manufacturers to improve their cleaning capabilities as well as speed up throughput, reduce costs and decrease environmental impact.