Assembly

Protecting POS terminals from attack

25 July, 2017

Three-dimensional moulded interconnect devices (3D-MIDs) are increasingly being used by manufacturers of POS terminals to improve security standards and fend off hacker attacks.


How to master power density for motor drives

19 July, 2017 by Stefan Hopfe* and Stefan Häuser^ | Supplied by: Semikron Pty Ltd

How can motor drive costs be optimised? The answer is by improving the power density through reducing the thermal impedance of the power system.


Rehm VXC series convection reflow systems

13 July, 2017 | Supplied by: Onboard Solutions

Rehm's VXC series convection reflow systems offer optimised heat transfer and thermal stability, with low real-world cross-profile performance, low MTBF and low power usage.


Extra Eye First Article Inspection process

12 July, 2017 | Supplied by: Onboard Solutions

Extra Eye's automated First Article Inspection process is said to be much faster than manual inspection. With set-up in minutes and easy operation, the process provides an alternative to automatic optical inspection (AOI) for low-volume series.


Rehm Thermal Systems Condenso XC Batch Vacuum Reflow System

11 July, 2017 | Supplied by: Onboard Solutions

The Condenso XC Batch Vacuum Reflow System is suitable for high-technology, large thermal mass, difficult soldering applications.


Hi-Q Components nylon 6/6 components for plastic circuit boards

10 July, 2017 | Supplied by: Hi-Q Electronics Ltd

Hi-Q Components stocks a large range of nylon 6/6 components commonly used in circuit board manufacturing. Nylon 6/6 is suitable for circuit board applications due to its chemical resistance, electrical insulation and high tensile strength.


Innovative enclosures for Industry 4.0

10 July, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/L

The development to Industry 4.0 affects the design and performance of enclosures for the installation of control units. As an enclosure specialist, ROLEC has incorporated these requirements into its current range.


Sun Industries Hybrid decals

07 July, 2017 | Supplied by: Sun Industries Pty Ltd

By incorporating digital processes into its graphics manufacturing, Sun Industries is able to offer full customisation of users' decals with durability characteristics.


DuPont and TactoTek collaborate on in-mould electronics

06 July, 2017 | Supplied by: DuPont (Aust) Limited

DuPont Electronics and Communications is collaborating with TactoTek, a designer and producer of injection-moulded electronics (IME), to meet the growing demand for IME solutions.


Tarapath Beta 300 2T benchtop moulding machine

06 July, 2017 | Supplied by: Tarapath Pty Ltd

The Beta 300 2T benchtop moulding machine processes the Technomelt range of materials to encapsulate and overmould various electronics, protecting them from environmental factors such as moisture, dust and vibration.


element14 Pi Desktop Raspberry Pi accessories

05 July, 2017 | Supplied by: element14

Pi Desktop is a set of Pi accessories which can convert Raspberry Pi 1/2/3 to a real computer.


3D printing using ultrasonic waves

04 July, 2017

Software company Neurotechnology is developing ultrasonic technology that will enable the 3D printing and assembly of almost any type of object using a wide range of different materials and components.


Improved cleaning performance for silicon wafer assemblers

03 July, 2017 | Supplied by: Electrolube

Electrolube has developed an innovative cleaning solution called Safewash Super (SWAS) for PCB wafer assemblers, following close collaboration with a number of manufacturers to improve their cleaning capabilities as well as speed up throughput, reduce costs and decrease environmental impact.


Markforged Mark Two and Mark X 3D printers

03 July, 2017 | Supplied by: Emona Instruments Pty Ltd

The Markforged range of 3D printers will print high-strength carbon fibre parts with the strength of metal for end-use products, prototypes, enclosures, brackets and mounts.


OKW adds applications webpages for enclosures

03 July, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/L

OKW has added a new Applications section to its website to help design engineers specify the best enclosures for their electronics.


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