Assembly

Liquid immersion cooling system launched in Hong Kong

10 October, 2024

The Hong Kong University of Science and Technology has launched an immersion cooling system to enhance the capacity of high-performance computing devices while reducing energy consumption.


Quantum computing experts conquer entanglement challenge in silicon chips

03 October, 2024 by University of New South Wales

Researchers have demonstrated the quantum entanglement of two electrons, each bound to a different atom of phosphorus, placed inside a silicon quantum computer chip.


Overcoming magnetic disorder in quantum insulators

12 September, 2024 by Monash University

A Monash-led team has demonstrated that the breakdown in topological protection in quantum insulators is caused by magnetic disorder.


Silicon chip enhances 6G communications

06 September, 2024

A team of scientists has unlocked the potential of 6G communications with a new polarisation multiplexer.


TTM Technologies XMWT80L1G RF termination

05 September, 2024 | Supplied by: Richardson RFPD

The TTM Technologies XMWT80L1G RF termination is designed to replace larger, bulkier caseless and connectorised terminations.


Electric reactor could cut industrial emissions

05 September, 2024 by Laura Castañón, Stanford University

Researchers at Stanford Engineering have developed a new thermochemical reactor that can generate the immense heat needed for industrial processes using electricity instead of fossil fuels.


STMicroelectronics X-CUBE-TCPP software pack

01 September, 2024 | Supplied by: STMicroelectronics Pty Ltd

The STMicroelectronics X-CUBE-TCPP software pack is designed to to simplify product designs by leveraging the USB Power Delivery specification.


An entire brain–machine interface on a chip

29 August, 2024 by Michael David Mitchell, EPFL

Researchers from EPFL have developed a next-generation miniaturised brain–machine interface capable of direct brain-to-text communication on tiny silicon chips.


Computer chips have the potential to become even smaller

22 August, 2024 by Werner Siefer, Paul Scherrer Institute

Researchers at the Paul Scherrer Institute have been improving the resolution of a process known as photolithography, in order to help advance the miniaturisation of computer chips.


Smart fabric powers self-sustaining electronics

22 August, 2024 by University of Waterloo

Researchers have developed a smart fabric based on MXene and conductive polymers that can convert body heat and solar energy into electricity.


Lithium extraction breakthrough: a step towards a greener future

15 August, 2024

Researchers have developed a cheaper and more efficient method of lithium extraction than conventional water-based methods.


VECOW IVX-1000 in-vehicle computing workstation

12 August, 2024 | Supplied by: Backplane Systems Technology Pty Ltd

The VECOW IVX-1000 in-vehicle computing workstation is designed to meet the needs of the mining industry, with software ignition power control and optional UPS support.


Soft gold enables connections between nerves and electronics

09 August, 2024 by Karin Söderlund Leifler, Linköping University

Researchers at Linköping University in Sweden have created new types of gold nanowires and soft electrodes that can be connected to the nervous system.


Unused Wi-Fi signals could be used to power electronics

09 August, 2024

A team of researchers has come up with a way of harvesting Wi-Fi signals to power small electronic devices.


Breakthrough towards highest-performing superconducting wire

09 August, 2024 by Tom Dinki, University at Buffalo

A new study has detailed how large-scale, cost-effective use of high-temperature superconducting wire is another step closer to reality.


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