Components

RECOM RPX2.5 all-in-one integrated power module

01 December, 2019 | Supplied by: RECOM Power GmbH

The RPX-2.5 all-in-one integrated module (buck regulator, inductor and capacitor) features flip-chip technology which increases power density and improves thermal management.


Laird Connectivity BL654PA power amplified module

29 November, 2019 | Supplied by: Mouser Electronics

The FCC, IC, RCM, KC and Bluetooth SIG-certified module allows engineers to implement single-mode Bluetooth 5 and Thread (802.15.4) technology into simple Bluetooth Low Energy designs.


Optical switch can reroute light in computer chips

29 November, 2019

The compact switch is claimed to be the first to operate at voltages low enough to be integrated onto low-cost silicon chips, and redirects light with very low signal loss.


NXP Semiconductors S32K ISELED-enabled microcontrollers

27 November, 2019 | Supplied by: Mouser Electronics

NXP Semiconductors has released its S32K ISELED-enabled microcontrollers. ISELED is an open alliance dedicated to providing next-generation smart LED lighting technology specifically geared towards automotive and industrial applications.


Tiny quantum chip enables secure communications

25 November, 2019

The quantum communication chip is said to be 1000 times smaller than current quantum set-ups, while offering the same high security that quantum technology is known for.


Würth Elektronik WE-STST Super Tiny Signal Transformers for LAN interfaces

22 November, 2019 | Supplied by: Wurth Electronics Australia Pty

Würth Elektronik's WE-STST Super Tiny Signal Transformers for LAN interfaces feature a maximum component height of 2.9 mm and can be used in up to 1000Base-T applications with at least 350 µH inductance.


NXP Semiconductors i.MX 7ULP applications processors

21 November, 2019 | Supplied by: Mouser Electronics

The i.MX 7ULP applications processors, from NXP Semiconductors, are based on Arm Cortex-A7 and Cortex-M4 cores with separate isolated domains, and include both 3D and 2D graphics processing units (GPUs).


Shape-changing electronics for wearable applications

20 November, 2019

A research team has developed a multifunctional electronic platform that can mechanically transform its shape, flexibility and stretchability.


Dietary fibre purifies carbon nanotubes

15 November, 2019

The method could be upscaled for manufacturing purified batches of single-wall carbon nanotubes for use in high-performance electronic devices.


Instabilities found on common semiconductor material

13 November, 2019

It turns out that the surface of a commonly used compound semiconductor material — gallium arsenide (GaAs) — is not as stable as previously thought.


Silicon III-V chips could be commercially manufactured

11 November, 2019

Researchers have announced a commercially viable way to manufacture integrated Silicon III-V chips with high-performance III-V devices inserted into their design.


Winmate Chassis Mount 4K UHD Military Display

08 November, 2019 | Supplied by: Backplane Systems Technology Pty Ltd

Winmate's Chassis Mount 4K UHD Military Display is a complete military-grade video wall solution engineered in 27″, 32″ and 40″ sizes and with 4K-UHD/HD options.


Silver nanowires offer transparency

08 November, 2019

Researchers have developed a submicrometre-thin mesh of silver nanowires that are transparent to light, highly electrically conductive, flexible, stretchable and simple to make.


STMicroelectronics and Audi partner on automotive lighting

07 November, 2019 | Supplied by: STMicroelectronics Pty Ltd

STMicroelectronics has announced its collaborative efforts with Audi to conceive, design, industrialise, manufacture and deliver the next generation of innovative automotive exterior OLED lighting.


Nordson DAGE Assure X-ray component counter

07 November, 2019 | Supplied by: Nordson Australia Pty Ltd

Nordson DAGE's Assure is an intelligent, simple and fast way for users to implement live component inventory management into their organisations.


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