KYOCERA AVX WBR Series microwave chip resistors
05 November, 2024 | Supplied by: Richardson RFPDThe KYOCERA AVX WBR Series of microwave chip resistors are designed to provide ultra-stable performance in applications that require thermos compression, epoxy or ultrasonic attachment.
Quectel BG770A-SN satellite communication module
05 November, 2024 | Supplied by: QuectelThe Quectel BG770A-SN satellite communication module is suitable for a range of applications including transportation, energy, maritime, heavy industry and agriculture.
STMicroelectronics STSAFE-TPM trusted platform modules
31 October, 2024 | Supplied by: STMicroelectronics Pty LtdSTMicroelectronics' range of STSAFE-TPM trusted platform modules is designed to provide cryptographic asset protection to meet security and regulatory requirements for critical information systems.
3D semiconductor chip alignment boosts performance
31 October, 2024 by University of Massachusetts AmherstResearchers have developed an ultra-precise method to align 3D semiconductor chips using lasers and holograms.
Ancient, 3D paper art helps shape modern wireless tech
18 October, 2024 by Drexel UniversityResearchers have used ancient 3D paper art, known as kirigami, to create tuneable radio antennas from MXene nanomaterials.
congatec COM Express Computer-on-Modules
17 October, 2024 | Supplied by: Congatec Australia Pty LtdThe congatec COM Express computer-on-modules are designed to provide up to 39 tera operations per second (TOPS) for AI inference.
Advantech UNO-148 V2 DIN-rail automation controller
10 October, 2024 | Supplied by: Advantech Australia Pty LtdThe Advantech UNO-148 V2 DIN-rail automation controller is designed to enhance real-time control and automation across AI-driven industries.
Researchers achieve 8 W output from optical parametric oscillator
10 October, 2024Researchers have demonstrated a total output power of 8 W from a high-power mid-infrared cadmium silicon diphosphide optical parametric oscillator.
"Dualtronic" chip for integrated electronics and photonics
03 October, 2024 by David Nutt, Cornell UniversityCornell researchers have developed a dual-sided chip known as a "dualtronic" chip that integrates both photonic and electronic functionalities.
Researchers illuminate inner workings of new-age soft semiconductors
03 October, 2024 by Andrew Myers, Stanford UniversityUsing a specialised electron microscope designed for delicate materials, materials scientists are exploring the microstructure of promising soft semiconductors that could lead to new-generation electronics.
An OLED for compact, lightweight night vision
26 September, 2024 by Patsy DeLacey, College of Engineering, University of MichiganThinner than a human hair, the device amplifies and converts near-infrared light into visible light with the potential for low power consumption and long battery life.
New discovery aims to improve the design of microelectronic devices
19 September, 2024 by University of MinnesotaTo enhance the effectiveness of data storage solutions, researchers have studied how next-generation electronics such as computer memory components malfunction or deteriorate over time.
Molecular coating technique boosts supercapacitors
12 September, 2024Researchers have effectively boosted the capacity, lifespan and cost-effectiveness of a capacitor by sprinkling a type of blue pigment onto activated carbon.
iEi PPC2-CW156A-ADLP industrial panel PC
11 September, 2024 | Supplied by: ICP Electronics AustraliaThe iEi PPC2-CW156A-ADLP industrial panel PC features dual 2.5GbE LAN ports, four USB 3.2 Gen1 ports and multiple M.2 expansion slots, for peripheral integration.
Quectel LG290P quad-band GNSS module
10 September, 2024 | Supplied by: QuectelThe Quectel LG290P quad-band GNSS module supports an advanced multi-frequency RTK algorithm, to enable rapid RTK high-precision positioning results.
