Würth Elektronik's WE-STST Super Tiny Signal Transformers for LAN interfaces feature a maximum component height of 2.9 mm and can be used in up to 1000Base-T applications with at least 350 µH inductance.
The i.MX 7ULP applications processors, from NXP Semiconductors, are based on Arm Cortex-A7 and Cortex-M4 cores with separate isolated domains, and include both 3D and 2D graphics processing units (GPUs).
A research team has developed a multifunctional electronic platform that can mechanically transform its shape, flexibility and stretchability.
The method could be upscaled for manufacturing purified batches of single-wall carbon nanotubes for use in high-performance electronic devices.
It turns out that the surface of a commonly used compound semiconductor material — gallium arsenide (GaAs) — is not as stable as previously thought.
Researchers have announced a commercially viable way to manufacture integrated Silicon III-V chips with high-performance III-V devices inserted into their design.
Researchers have developed a submicrometre-thin mesh of silver nanowires that are transparent to light, highly electrically conductive, flexible, stretchable and simple to make.
STMicroelectronics has announced its collaborative efforts with Audi to conceive, design, industrialise, manufacture and deliver the next generation of innovative automotive exterior OLED lighting.
Compared to traditional analog architectures and methodologies, the design turnaround time for the novel sensor interfaces is reduced from months to hours.
The CC3235MODx SimpleLink dual-band wireless microcontroller modules, from Texas Instruments (TI), integrate a high-performance application processor, network processor and crypto engine in a single chip with a rich set of peripherals.
Researchers from Queen Mary University of London, seeking to solve a sustainable energy storage problem, have found inspiration in the most unlikely of places: the humble croissant.
Renesas Electronics Corporation has introduced the RX23E-A series of 32-bit microcontrollers (MCUs), combining a high-precision analog front end (AFE) and an MCU on a single chip.