STMicroelectronics STM32MP2 industrial microprocessors
17 April, 2024 | Supplied by: STMicroelectronics Pty LtdThe STM32MP2 industrial microprocessors from STMicroelectronics are designed for demanding and time-sensitive workloads, AI inferencing and communication.
Quectel RG255G MediaTek-based module
17 April, 2024 | Supplied by: QuectelThe Quectel RG255G MediaTek-based module features MediaTek's 5G RedCap UltraSave capability which results in low power consumption and power saving.
Toshiba TK042N65Z5, TK095N65Z5 power MOSFETs
16 April, 2024 | Supplied by: Toshiba (Australia) Pty LtdThe Toshiba TK042N65Z5 and TK095N65Z5 power MOSFETs use high-speed diodes to enhance the reverse recovery characteristics required for bridge circuit and inverter circuit applications.
APLEX ABOS-916CP panel PC
16 April, 2024 | Supplied by: Backplane Systems Technology Pty LtdThe APLEX ABOS-916CP panel PC features built-in RAFI FS22+ functional buttons, including real push-buttons that provide intuitive control over complex processes.
STMicroelectronics STM32WBA5 wireless microcontrollers
16 April, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics STM32WBA5 wireless microcontrollers enable wearables and smart objects such as smart home devices to become more miniaturised and easy to use.
Quectel NCM825, NCM825A Wi-Fi 7 modules
16 April, 2024 | Supplied by: QuectelThe Quectel NCM825, NCM825A Wi-Fi 7 modules offer support for Intel and AMD x86 platforms as well as the Snapdragon X Elite platform for leading Windows PC experiences.
Fully coupled annealing processor for enhanced problem solving
03 April, 2024Researchers have designed a scalable, fully-coupled annealing processor with 4096 spins, and parallelised capabilities for accelerated problem-solving.
STMicroelectronics breaks 20 nm barrier for next-gen microcontrollers
21 March, 2024 | Supplied by: STMicroelectronics Pty LtdSTMicroelectronics has launched an advanced process based on 18 nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory to support embedded processing devices.
3D reflectors help boost data rate in wireless communications
14 March, 2024 by David Nutt, Cornell ChronicleCornell researchers have developed a semiconductor chip that will enable smaller devices to operate at the higher frequencies needed for future 6G communications.
Scientists revolutionise wireless communication with 3D processors
08 March, 2024 by Karen Dooley, University of FloridaScientists have developed a method for using semiconductor technology to manufacture processors that enhance the efficiency of transmitting data across the globe.
u-blox NORA-W4 Wi-Fi 6 module
08 March, 2024 | Supplied by: u-blox Singapore Pte LtdThe u-blox NORA-W4 Wi-Fi 6 module is suitable for IoT applications such as smart home, asset tracking, health care and industrial automation.
Neousys NRU-154PoE-FT Edge AI computer
01 March, 2024 | Supplied by: Backplane Systems Technology Pty LtdThe Neousys NRU-154PoE-FT Edge AI computer delivers up to 100 TOPS AI inference performance, making it suitable for a range of industrial and environmental conditions.
STMicroelectronics NeoChromVG GPU
01 March, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics NeoChromVG GPU is a vector graphics accelerator for general-purpose microcontrollers.
STMicroelectronics TSZ151 operational amplifiers
01 March, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics TSZ151 operational amplifiers are designed to lend stability to circuits for sensor interfacing, signal conditioning and current measurement.
Advantech ARK-2251 fanless edge computer
01 March, 2024 | Supplied by: Advantech Australia Pty LtdThe Advantech ARK-2251 fanless edge computer offers a range of connectivity options to facilitate integration with various sensors and devices.
