Axiomtek CEM710 COM Express Type 7 module
12 November, 2024 | Supplied by: TekdisThe Axiomtek CEM710 COM Express Type 7 module is suitable for embedded edge AI servers, high-end network testers, network traffic probes and rugged edge applications.
Unlocking next-gen chip efficiency
07 November, 2024 by University of Virginia School of Engineering and Applied ScienceBy studying how heat moves through ultra-thin metal layers, researchers have provided a foundation for designing smaller, faster and cooler electronic devices.
STMicroelectronics Page EEPROM two-in-one memory
06 November, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics Page EEPROM two-in-one memory is suitable for applications such as healthcare devices, asset trackers and e-bikes, as well as other industrial and consumer products.
Quectel EG91-EX LTE Cat 1 module
06 November, 2024 | Supplied by: QuectelThe Quectel EG91-EX LTE Cat 1 module is optimised for M2M and IoT applications, and offers data rates of up to 10 Mbps for downlink and 5 Mbps for uplink.
KYOCERA AVX WBR Series microwave chip resistors
05 November, 2024 | Supplied by: Richardson RFPDThe KYOCERA AVX WBR Series of microwave chip resistors are designed to provide ultra-stable performance in applications that require thermos compression, epoxy or ultrasonic attachment.
Quectel BG770A-SN satellite communication module
05 November, 2024 | Supplied by: QuectelThe Quectel BG770A-SN satellite communication module is suitable for a range of applications including transportation, energy, maritime, heavy industry and agriculture.
STMicroelectronics STSAFE-TPM trusted platform modules
31 October, 2024 | Supplied by: STMicroelectronics Pty LtdSTMicroelectronics' range of STSAFE-TPM trusted platform modules is designed to provide cryptographic asset protection to meet security and regulatory requirements for critical information systems.
3D semiconductor chip alignment boosts performance
31 October, 2024 by University of Massachusetts AmherstResearchers have developed an ultra-precise method to align 3D semiconductor chips using lasers and holograms.
Ancient, 3D paper art helps shape modern wireless tech
18 October, 2024 by Drexel UniversityResearchers have used ancient 3D paper art, known as kirigami, to create tuneable radio antennas from MXene nanomaterials.
congatec COM Express Computer-on-Modules
17 October, 2024 | Supplied by: Congatec Australia Pty LtdThe congatec COM Express computer-on-modules are designed to provide up to 39 tera operations per second (TOPS) for AI inference.
Advantech UNO-148 V2 DIN-rail automation controller
10 October, 2024 | Supplied by: Advantech Australia Pty LtdThe Advantech UNO-148 V2 DIN-rail automation controller is designed to enhance real-time control and automation across AI-driven industries.
Researchers achieve 8 W output from optical parametric oscillator
10 October, 2024Researchers have demonstrated a total output power of 8 W from a high-power mid-infrared cadmium silicon diphosphide optical parametric oscillator.
"Dualtronic" chip for integrated electronics and photonics
03 October, 2024 by David Nutt, Cornell UniversityCornell researchers have developed a dual-sided chip known as a "dualtronic" chip that integrates both photonic and electronic functionalities.
Researchers illuminate inner workings of new-age soft semiconductors
03 October, 2024 by Andrew Myers, Stanford UniversityUsing a specialised electron microscope designed for delicate materials, materials scientists are exploring the microstructure of promising soft semiconductors that could lead to new-generation electronics.
An OLED for compact, lightweight night vision
26 September, 2024 by Patsy DeLacey, College of Engineering, University of MichiganThinner than a human hair, the device amplifies and converts near-infrared light into visible light with the potential for low power consumption and long battery life.
