Components

STMicroelectronics Page EEPROM two-in-one memory

06 November, 2024 | Supplied by: STMicroelectronics Pty Ltd

The STMicroelectronics Page EEPROM two-in-one memory is suitable for applications such as healthcare devices, asset trackers and e-bikes, as well as other industrial and consumer products.


Quectel EG91-EX LTE Cat 1 module

06 November, 2024 | Supplied by: Quectel

The Quectel EG91-EX LTE Cat 1 module is optimised for M2M and IoT applications, and offers data rates of up to 10 Mbps for downlink and 5 Mbps for uplink.


Quectel BG770A-SN satellite communication module

05 November, 2024 | Supplied by: Quectel

The Quectel BG770A-SN satellite communication module is suitable for a range of applications including transportation, energy, maritime, heavy industry and agriculture.


KYOCERA AVX WBR Series microwave chip resistors

05 November, 2024 | Supplied by: Richardson RFPD

The KYOCERA AVX WBR Series of microwave chip resistors are designed to provide ultra-stable performance in applications that require thermos compression, epoxy or ultrasonic attachment.


3D semiconductor chip alignment boosts performance

31 October, 2024 by University of Massachusetts Amherst

Researchers have developed an ultra-precise method to align 3D semiconductor chips using lasers and holograms.


STMicroelectronics STSAFE-TPM trusted platform modules

31 October, 2024 | Supplied by: STMicroelectronics Pty Ltd

STMicroelectronics' range of STSAFE-TPM trusted platform modules is designed to provide cryptographic asset protection to meet security and regulatory requirements for critical information systems.


Ancient, 3D paper art helps shape modern wireless tech

18 October, 2024 by Drexel University

Researchers have used ancient 3D paper art, known as kirigami, to create tuneable radio antennas from MXene nanomaterials.


congatec COM Express Computer-on-Modules

17 October, 2024 | Supplied by: Congatec Australia Pty Ltd

The congatec COM Express computer-on-modules are designed to provide up to 39 tera operations per second (TOPS) for AI inference.


Researchers achieve 8 W output from optical parametric oscillator

10 October, 2024

Researchers have demonstrated a total output power of 8 W from a high-power mid-infrared cadmium silicon diphosphide optical parametric oscillator.


Advantech UNO-148 V2 DIN-rail automation controller

10 October, 2024 | Supplied by: Advantech Australia Pty Ltd

The Advantech UNO-148 V2 DIN-rail automation controller is designed to enhance real-time control and automation across AI-driven industries.


Researchers illuminate inner workings of new-age soft semiconductors

03 October, 2024 by Andrew Myers, Stanford University

Using a specialised electron microscope designed for delicate materials, materials scientists are exploring the microstructure of promising soft semiconductors that could lead to new-generation electronics.


"Dualtronic" chip for integrated electronics and photonics

03 October, 2024 by David Nutt, Cornell University

Cornell researchers have developed a dual-sided chip known as a "dualtronic" chip that integrates both photonic and electronic functionalities.


An OLED for compact, lightweight night vision

26 September, 2024 by Patsy DeLacey, College of Engineering, University of Michigan

Thinner than a human hair, the device amplifies and converts near-infrared light into visible light with the potential for low power consumption and long battery life.


New discovery aims to improve the design of microelectronic devices

19 September, 2024 by University of Minnesota

To enhance the effectiveness of data storage solutions, researchers have studied how next-generation electronics such as computer memory components malfunction or deteriorate over time.


Molecular coating technique boosts supercapacitors

12 September, 2024

Researchers have effectively boosted the capacity, lifespan and cost-effectiveness of a capacitor by sprinkling a type of blue pigment onto activated carbon.


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