Siemens launches AI agent to automate PCB design workflows
19 March, 2026Siemens has introduced the Fuse EDA AI Agent to automate workflows across semiconductor, 3D integrated circuit and printed circuit board system design.
ADLINK ISB-W890 server board
18 March, 2026 | Supplied by: ADLINK Technology IncADLINK has introduced the ISB-W890 server board, scaling Edge AI from traditional workloads to real-time generative AI and advanced analytics.
Glyn D1SE DIN rail power supply
18 March, 2026 | Supplied by: Glyn LtdThe D1SE DIN rail power supply is designed to reduce energy consumption and is suitable for a variety of control cabinets, machines and production systems.
AMD VPR-7P132 Mini-ITX embedded motherboard
18 March, 2026 | Supplied by: Avnet Asia Pte LtdThe mini-ITX embedded motherboard enables industrial and automotive developers to leverage multiple compute engines in parallel to process image and sensor data in real time.
Glyn DUSH uninterruptible DC power supplies
18 March, 2026 | Supplied by: Glyn LtdThe DUSH uninterruptible DC power supplies from Glyn are suitable for a range of applications, including industry automation, plant engineering, and test and measuring technology.
Flexible fibre actuator converts electricity into motion
11 March, 2026Researchers have developed ultra-thin soft fibres that bend and move when powered by electricity, creating flexible actuators that could power next-gen wearable tech.
Aerotech AGV-CPO 2-Axis laser scan head
04 March, 2026 | Supplied by: Coherent Scientific Pty LtdThe AGV-CPO 2-Axis laser scan head is designed to suit a range of laser applications, including electronics and semiconductor components manufacturing.
RECOM RACPRO1-S120 DIN-rail AC/DC power supply unit
01 March, 2026 | Supplied by: RECOM Asia Pte LtdThe RACPRO1-S120 DIN-rail AC/DC power supply unit is designed for industrial automation, building control and infrastructure applications across Australia.
Turning peanut waste into graphene for next-gen electronics
26 February, 2026 by Neil Martin, UNSWUNSW Sydney engineers have developed a cheaper and greener way to make graphene from leftover peanut shells.
Light-powered optical modules boost AI efficiency
19 February, 2026 by Ty Tkacik, Penn State UniversityResearchers have developed a new generation of AI hardware that runs on light instead of electricity to process information.
Designing smarter circuits with intelligent tools
18 February, 2026Researchers have developed an artificial intelligence technology to automate analog semiconductor design.
Teledyne SCION VIS-SWIR cameras
21 January, 2026 | Supplied by: Teledyne e2v Asia Pacific LimitedTeledyne has launched the SCION Family of short-wave infrared (SWIR) cameras for a range of applications including material analysis and defect detection.
STMicroelectronics STM32MP21 microprocessors
15 January, 2026 | Supplied by: STMicroelectronics Pty LtdThe STM32MP21 microprocessors from STMicroelectronics feature a powerful processing engine and robust security architecture.
New materials could boost the energy efficiency of microelectronics
13 January, 2026 by Adam Zewe, MIT NewsBy stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
Nano framework unlocks printable 2D electronics
11 December, 2025 by Trinity College DublinResearchers have developed a predictive framework for 2D-material exfoliation — enabling low-cost, printable electronics including transistors, circuits and flexible sensors.
