Solder paste aid

Monday, 27 April, 2009 | Supplied by: Embedded Logic Solutions Pty Ltd


The LPKF StencilCheck software inspects SMT stencils for cleanliness to verify that each aperture is free of debris. Only an absolutely clean stencil ensures an entire and reliable paste release when printing.

The inspection saves time for test printings and is more reliable than a visual inspection.

Based on a commercially approved PC — scanner (which is not part of the delivery) the software generates one optical scan of the SMT solder paste stencil. This scan will be compared against the CAD production data. Any impurities in the stencil will be shown directly on the PC. A full report can be printed and used for the QC management.

The system is suitable for various application fields including: controlling cleanliness after stencil cleaning or before starting production; controlling stencil service lives by testing the influence of the squeegees and printing parameters on the SMT stencil; accuracy check and certification by the stencil manufacturer; generating stencil cutting data from PCB scans or the existing solder paste stencil; and tracing the quality of delivered solder paste stencils: copes of the scan can be archived.

Online: www.emlogic.com.au
Phone: 02 9687 1880
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