Osram to switch fabrication of red and yellow LEDs to 6″ wafers
Osram Opto Semiconductors is switching its fabrication of red, orange and yellow light-emitting diodes to 6″ wafers.
The German company is extending the fabrication of all large-wafer LEDs to the indium-gallium-aluminium-phosphide (InGaAlP) material system and expanding its production capacity. The company began switching fabrication of blue LED chips back in 2011.
The latest switch involves chips for LEDs intended for a wide range of applications. Red and yellow LEDs are used in virtually every sector: as turn indicators, brake lights and interior vehicle lighting in the automotive sector, in displays, for projection, for signage and for colour mixing systems in general illumination.
“The demand for light-emitting diodes in red, orange and yellow continues to grow. We are keeping pace with this demand by being the first manufacturer in the world to switch fabrication to 6″ wafers - thereby also expanding our capacity,” said Aldo Kamper, CEO of Osram Opto Semiconductors. “The switch will involve all product families and was initiated at the start of the year,” he added. The red, yellow and orange chips will be fabricated at the company headquarters in Regensburg. InGaN chips for blue, green and white LEDs are also produced there, as well as in Penang, Malaysia.
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