ADLINK has launched the COM-HPC-mMTL — an innovative module that features Intel Core Ultra architecture and rich I/O capabilities. This makes it suitable for edge applications that require enhanced processing power and versatile connectivity.
The module is powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores and an integrated NPU for high-performance AI acceleration. It is designed for high-performance, energy efficient battery-powered applications, such as industrial automation, data loggers, UAVs (unmanned aerial vehicles), portable medical ultrasound devices and AI-powered robots.
The module features up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467 MT/s, supporting maximum performance and efficiency. Its 95x70 mm size allows it to fit into constrained spaces, with a rugged operating temperature range from -40 to 85°C (for selected SKUs).
Despite its compact form factor, the embedded module integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.
ADLINK offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the second half of 2025.
Phone: 0011 886 2 8226 5877
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