congatec COM-HPC Size A computer-on-modules

congatec has launched the COM-HPC Size A (conga-HPC/cRLP) and COM Express (conga-TC675) computer-on-modules based on high-end 13th Gen Intel Core processors in BGA assembly.

Series production of the OEM designs based on these new modules are forecast to increase as the new processors with long life availability offer improvements in many features and are fully hardware compatible with the predecessors, to facilitate easy implementation.

With Thunderbolt and enhanced PCIe support up to Gen5, the modules based on the new COM-HPC standard allow developers to enhance data throughput, I/O bandwidth and performance density. The COM Express 3.1 compliant modules primarily help to secure investments in existing OEM designs, which includes upgrade options for more data throughput due to PCIe Gen4 support.

All new features provide improvements to a range of industrial, medical, artificial intelligence (AI) and machine learning (ML) applications, as well as all types of embedded and edge computing with workload consolidation.