Siliconix has announced a family of TrenchFET power MOSFETs in a reverse-lead TO-252 DPAK package.
The reverse-formed leads of the 'SUR'-packaged TrenchFETs allow the device to be mounted inversely on the PCB with a heat sink on top, enabling cooler operation.
Because heat generated from power can be dissipated to the air rather than to the PCB, each MOSFET features a lower effective on-resistance value and higher current capability than DPAK power MOSFETs with conventional lead-outs.
Control Devices APEM PKI Series keypads
The APEM PKI Series of keypads features silicone keys for tactile feedback and high-intensity RGB...
IMP Electronics DT035CTFT IPS LCD module
The DT035CTFT IPS LCD module from IMP Electronics is suitable for industrial, consumer and...
Teledyne FLIR Lepton XDS thermal-visible camera module
The Lepton XDS ISP–powered dual camera module is designed to deliver enhanced performance...

