Toshiba DSOP Advance package MOSFETs
Toshiba Corporation’s Semiconductor & Storage Products Company has launched a surface-mount package series as part of its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The devices have a heat sink on both sides of the package to improve heat dissipation, making it possible to realise high-current operations in compact packages.
The MOSFETs share the same 5 x 6 mm footprint as Toshiba’s current SOP Advance package, facilitating replacement without any need to modify existing PCB layouts. They are suitable for switching power supplies for servers and mobile devices.
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