Vincotech VINco E3 power IGBTs

Wednesday, 26 April, 2017 | Supplied by: Wireless Components


The Vincotech VINco E3 power IGBTs are designed for motion control, solar and UPS applications.

The product features SLC (SoLid Cover) technology in an industry-standard low-profile package. It enables engineers to design mid-power inverters with higher output current, higher power density and improved reliability for motion control, industrial drives, solar power, UPS and other mid-power applications.

The insulated metal baseplate combines an electrically insulating resin layer with direct-bonded top- and bottom-side copper layers. It replaces the substrate solder layer and separate baseplate to achieve high thermal cycling capability, reduced thermal resistance, and high power density and low stray inductance. Direct potting resin distributes the mechanical stress more uniformly than silicone gel for improved power cycling capability.

Online: www.wirelesscomponents.com.au
Phone: 02 8883 4670
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