Sealed up with MEMS and IC technologies
A wafer scale foundry-based method of hermetically sealing surface sensitive devices such as MEMS and RF has been released by Ziptronix. It operates at room temperature using industry standard tools and materials and incorporating both MEMS and IC technologies.
A covalent bonding between conventional semiconductor materials or other materials used in MEMS packaging is produced. The bond is created without the use of applied pressure, electric field or epoxies and other adhesives. The surface activation is fully compatible with the normal fab environment.
Semiconductor foundries, IDMs and MEMS manufacturers can assemble, package and test the devices in-house using this process.
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