Sealed up with MEMS and IC technologies
A wafer scale foundry-based method of hermetically sealing surface sensitive devices such as MEMS and RF has been released by Ziptronix. It operates at room temperature using industry standard tools and materials and incorporating both MEMS and IC technologies.
A covalent bonding between conventional semiconductor materials or other materials used in MEMS packaging is produced. The bond is created without the use of applied pressure, electric field or epoxies and other adhesives. The surface activation is fully compatible with the normal fab environment.
Semiconductor foundries, IDMs and MEMS manufacturers can assemble, package and test the devices in-house using this process.
New memristor chips boost AI efficiency
Researchers have developed a brain-inspired memristor chip that could make AI more energy...
Tiny chip adds advanced light sensing directly to cameras
Researchers have developed a tiny camera chip that integrates advanced light sensing, helping...
Mechanical computer operates without electricity or chips
Researchers have developed a mechanical computer using springs and bolts to perform logic...
