Connector technology roadmap report

Wednesday, 06 August, 2003

Bishop and Associates has released a report covering technology roadmapping on electronic connectors. It includes the National Electronic Manufacturing Initiative (NEMI) 2002 Electronics Industry Roadmap on CD.

The report covers a 10 year roadmap of selected elements of the electronic connector industry from 2003 to 2013, a review of connector technology trends and a discussion of roadmapping process. It contains PCB connectors, backplane connectors, processor and memory test sockets power connectors, high-speed connectors, etc. It also includes an interpretation of the NEMI roadmaps impact on connectors.

The intent is to expand on this data for future reports, adding additional product categories, industry segment analyses and support for the 2004 NEMI roadmap process.

The Connector Technology Roadmap Report includes insights into outsourcing to EMS, ODM and other subcontractors and the move to high volume system manufactuing to China. It discusses how these dynamics will affect the connector industry, which is also increasing its presence in China to maintain customers and remain competitive. Questions emerge about the future of western manufacturing and RD&E infrastruture that support these high volume markets. This is affecting standard product manufacturing and supply chains such as mobile phones and PDAs, notebook and desktop computers and PC motherboards, PC servers, computer peripherals, telecom equipment, etc. Even the increasingly competitive automotive sector will be subject to these trends.

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