Erni says that the CompactPCI Express PICMG EXP.0 R1.0 specification is supported by compliant ERmet ZD and HM ERmet connectors.
PICMG released the EXP.0 specification which enables a smooth migration path to the PCI Express technology on the PICMG 2.0 CompactPCI form factor.
The specification meets the future needs of CompactPCI users in instrumentation, military and aerospace markets and defines the connectors, electrical and mechanical requirements of boards (3U, 6U) and backplanes.
The system slot (board) is defined to have up to 24 lanes and up to four PCI Express links, with a maximum of 6 GBps system bandwidth per direction.
Peripheral slots can have up to 16 lanes/4 GBps (type 1 peripheral board) or eight lanes/2 GBps (type 2 peripheral board).
PICMG EXP.0 uses the ERmet ZD connector called Advanced Differential Fabric, a connector used by ATCA to carry the PCI Express signals.
Crucial criteria for compliant connectors include the reliable transmission of high-speed signals combined with physical fit, high contact density, support of other industry standards and reliable delivery backed up by a second source.
The high-speed connectors meet these above requirements. Extensive simulations verified the reliability of signal transmission at 6 Gbps and above.
The ERmet ZD connectors (three-row version) comply with the new CompactPCI Express standard and offer 30 differential contact pairs per linear 25 mm on the connector (card edge).
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