Interplex Multi-Row Board-to-Board connector

Interplex has released its Multi-Row Board-to-Board (BTB) connector featuring an innovative snap-in biscuit design. This interconnect concept allows multiple connector units to be stacked together. This means interconnections can be appropriately sized while avoiding the need for them to be custom built. This unique approach will enable different pin count requirements to be attended to via the same basic interconnect platform, without any extra expense or engineering effort.

The BTB connectors feature 0.4 mm miniPLX press-fit pins, so the need for soldering is eliminated. These pins are made from a copper alloy and exhibit low levels of contact resistance (<1 mΩ). Each pin has a 3 A current carrying capability. The optional coating of these pins with the company’s patented IndiCoat plating technology mitigates tin whisker build-up, in order to prevent the risk of short circuits and extend operational lifespan.

The BTB connectors are available in board stacking heights from 7 to 30 mm. They can have between one and six rows, with up to 30 contact terminals being incorporated into each row. Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (8 h cycling up to 10% RH), shocks (35g for 5 to 10 ms across 10 axes) and vibrations (8 h per axis). A working temperature range of -40 to +150°C is also supported.

There are a number of applications that the robust Multi-Row BTB connectors can be targeted at, including electric vehicles (EVs), particularly for electric power steering and electronic control unit functions. There are also opportunities for these connectors to be used in industrial automation systems (as robots), transportation hardware (trains) and medical instrumentation (such as imaging scanners).