Micro pitch high-density interconnects

Samtec’s Searay interconnect system offers high-speed performance, grounding and routing flexibility of its 1.27 x 1.27 mm open pin field, but with a 0.8 mm micro pitch design that requires 50% less board space. This real estate-saving, high-density system is available in 4- and 6-row designs with up to 180 I/Os. Pin counts up to 300 I/Os are expected soon.

Its micro pitch terminals and sockets and Samtec’s Edge Rate contact system are designed for good signal integrity in rugged and high-cycle applications. The contact design also lowers insertion and extraction forces, which is an important consideration when designing-in high pin count arrays.

The 0.8mm system comes with a standard choice of 7 and 10 mm stack heights and lead-free solder charge terminations. Its interconnects use solder charge technology to simplify IR reflow termination and improve solder joint reliability. This reduces exposure to extreme heat, which is especially relevant with the higher temperature required for lead-free processing.

The high-speed, high-density interconnect family includes 1.27 x 1.27 mm grid array systems with up to 500 I/Os. They are available with stack heights from 7 to 17.5 mm, right-angle designs for high-speed micro backplane applications and a press-fit design which eliminates processing concerns for BGA-style connectors. 

The interconnect system is a low-profile, high-density array with stack heights as low as 4 mm. Mating high-speed coax cable assemblies, high-density riser systems up to 40 mm and 85 Ω stackers are also available.