Molex PowerWize BMI Panel-to-Board/Busbar Interconnects

Mouser Electronics, Inc. now ships the PowerWize BMI high-current panel-to-board/busbar interconnects from Molex. Dense electronic packaging often requires designs where subassemblies are mated without visual guidance. These interconnects provide engineers with high current-carrying capacity and accurate mating in hard-to-reach and visually obscured applications like data centre power transmission systems, base stations, battery management inverters and electric vehicle charging stations.

The high-current blind-mating panel-to-board/panel-to-busbar connectors incorporate Molex’s COEUR socket technology, where the panel-mounted receptacle housing’s guideposts align with the inner surfaces of the header sidewalls, before contacts and pins engage, to facilitate blind mating. These conical sockets also offer low contact resistance and low voltage drop, creating minimal heat generation at the contact interface, resulting in higher current-carrying capacity compared to other contact designs. The headers and receptacles are also designed to meet industry-standard, safe-to-touch requirements.

The PowerWize BMI High-Current Panel-to-Board/Busbar Interconnects offer screw-mount pins attached to printed circuit boards or busbars with solder tail pins to enhance manufacturing flexibility in three different sizes: 3.40 (75.0 A), 6.00 (110.0 A) and 8.00 mm (175.0 A). Cable assemblies feature ±2.00 mm of radial self-alignment to mitigate stack-up tolerance issues. At the same time, the reflow-capable/wave solder-capable solder tail headers are suitable for either pin-in-paste reflow PCB processing or wave solder PCB processing. PowerWize BMI crimp machined contacts offer a wide range and will accept 1/0, 2, 4, 6, 8, or 10 AWG wires.