Molex zCD Interconnect System connector

The Molex zCD Interconnect System connector is designed for next-generation 400 Gbps Ethernet applications.

The product enables 4.4 TBps with 11 modules on a line card to support next-generation 400 Gigabit Ethernet. The short-body passive connector accepts both passive and active copper cables. The compact form factor is constructed on a straight, back-route footprint with a 0.75 mm pitch. The small pitch eliminates footprint side-routing, and the overall design of the connector provides industry-leading port-count density with close placement along the panel.

The connector comes equipped with an elastomeric gasket for superior electromagnetic interference (EMI) containment and suppression, a press-fit connector design to ensure a robust and simple board termination, and good thermal management that accepts a broad range of customer-specified thermal modules and heat sinks. The connector is suitable for a wide variety of Ethernet-based applications, including telecommunication devices, core switches, routers, data centres, enterprise computing devices, top of rack (TOR) switches and any other Ethernet application requiring 400 Gbps interfaces.