Power module

Semikron has released SKiiP, an intelligent power module with matched cooling, gate driver, current sensors and protective functions already integrated.

High load and temperature cycling capability are possible with pressure contact technology. With a power output into the MW range, this IGBT subsystem is claimed to be the most powerful IPM available.

The technology used for the halfbridges is to use mechanical pressure via the pressure plate and the bridge element, pressing the DBC to the heat sink without soldering - a thermal paste of merely 10-20 µm is needed. This results in a homogenous pressure distribution.

A thermal connection between the ceramic substrates carrying the semiconductor chips and the heat sink is produced. This leads to an improved thermal resistance (Rth(j-s)) of 40% compared with standard solutions.

The system has no base plate and fewer solder layers with the result that there is lower thermal-mechanical stress inside the module. The thermal cycling capability is five times higher than other solutions with base plate and is reached even under the harsh climatic conditions.