Thermal management — the key to extending device lifetime
Supplied by Electrolube on Thursday, 02 June, 2016
Electronic components often generate significant amounts of heat while in use. Failure to effectively dissipate this heat away from the device can lead to reliability concerns and reduce operational lifetimes.
Download this white paper to learn how to select and apply thermal materials on your design to effectively dispel heat and optimise your device.
Related White Papers
How power averaging cuts your power system costs
Specifying your power system to meet its peak requirement of a pulsed load is expensive,...
Factorised Power Architecture — achieving high density and efficiency in board-mounted power
Solving today's high-current and high-density point-of-load (PoL) problems requires a...
Will self-driving cars guarantee your safety?
Smart cars continue to expand autonomous driving tasks that assist or even outright...
