Thermal management — the key to extending device lifetime

Supplied by Electrolube on Thursday, 02 June, 2016


Electronic components often generate significant amounts of heat while in use. Failure to effectively dissipate this heat away from the device can lead to reliability concerns and reduce operational lifetimes.

Download this white paper to learn how to select and apply thermal materials on your design to effectively dispel heat and optimise your device.


Related White Papers

Eliminate intermediate energy storage in EV power architectures

Learn about the BCM converter’s function, operation and capabilities as compared to a...

Your essential guide to thermal paste application

This extensive paper describes the application of thermal paste (grease) as a thermal interface...

Fast startup solutions for sensorless motors

Learn how to solve various problems that tend to occur with sensorless motors, making it possible...


  • All content Copyright © 2025 Westwick-Farrow Pty Ltd