Thermal management — the key to extending device lifetime

Supplied by Electrolube on Thursday, 02 June, 2016


Electronic components often generate significant amounts of heat while in use. Failure to effectively dissipate this heat away from the device can lead to reliability concerns and reduce operational lifetimes.

Download this white paper to learn how to select and apply thermal materials on your design to effectively dispel heat and optimise your device.


Related White Papers

New highly efficient bidirectional DC-DC converter for DC-BUS and battery bank interface

With the growth in use of renewable sources of power, the energy storage systems (ESS) market,...

Advanced 3-level topologies for solar applications

Learn about 3-Level topologies, future trends in the solar sector and requirements.

Smart metering for electronic design engineers

After years of being relatively static, the climate is now ripe for innovation in the area of...


  • All content Copyright © 2025 Westwick-Farrow Pty Ltd